A new technical paper titled "Monolithically Integrated Optical Through-Silicon Waveguides for 3D Chip-to-Chip Photonic Interconnects" was published by researchers at the Technical University of Applied Sciences Wildau, TU of Applied Sciences Mittelhessen, TU Ilmenau, Brandenburg University of Technology and Fraunhofer IPMS.
Abstract
"The scaling limitations of electrical interconnects are ...
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