The Week in Review: IoT

By Jeff Dorsch - 22 Nov, 2017 - Comments: 0

Commentary Chris Voce of Forrester Research writes that the Internet of Things next year will move beyond experimentation in this piece. “At Forrester we believe IoT extends beyond devices and connectivity,” he writes. “But it's the business impact of IoT that truly defines what it is: the insights that you can derive with analytics and the business outcomes you can achieve.” M&A M... » read more

Carriers Push Datacenter-Style Virtualization

By Gale Morrison - 01 Jun, 2017 - Comments: 0

The world’s largest telco carriers are leading a broad movement to bring data center-style virtualization to the core of their telecommunications networks. In an industry known for being extremely conservative when it comes to change, this one appears to be significant. The move has set off a scramble among a number of companies for unified control and forwarding plane designs, starting fr... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 04 Nov, 2016 - Comments: 0

Samsung Austin Semiconductor plans to invest more than $1 billion in its fab in Austin, Texas. Today, the fab continues to ramp up the company’s 14nm finFET technology. At the same time, Samsung is expanding its advanced finFET foundry process technology offerings with its fourth-generation 14nm process (14LPU) and its third-generation 10nm technology (10LPU). Graphcore is developing a so-... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Brocade

The Week in Review: IoT

Carriers Push Datacenter-Style Virtualization

The Week In Review: Manufacturing