tag: Cadence

The Growing Challenge Of Thermal Guard-Banding
By Ann Mutschler - 18 Mar, 2019 - Comments: 1

Guard-banding for heat is becoming more difficult as chips are used across a variety of new and existing applications, forcing chipmakers to architect their way through increasingly complex interactions. Chips are designed to operate at certain temperatures, and it is common practice to develop designs with some margin to ensure correct functionality and performance throughout the operat... » read more

Week In Review: Design, Low Power
By Jesse Allen - 15 Mar, 2019 - Comments: 0

M&A Nvidia will acquire Mellanox for $6.9 billion in cash, the largest deal in the chipmaker's history. Traditionally a PC GPU company, Nvidia has made a push into high-performance computing, particularly for AI workloads. Founded in 1999, Israel-based Mellanox focuses on end-to-end Ethernet and InfiniBand interconnect solutions and services for servers and storage. According to Nvidia, Me... » read more

Using Less Power At The Same Node
By Brian Bailey - 14 Mar, 2019 - Comments: 0

Going to the next node has been the most effective way to reduce power, but that is no longer true or desirable for a growing percentage of the semiconductor industry. So the big question now is how to reduce power while maintaining the same node size. After understanding how the power is used, both chip designers and fabs have techniques available to reduce power consumption. Fabs are makin... » read more

IC Test: Doing It At The Right Place At The Right Time
By Rohit Kapur - 14 Mar, 2019 - Comments: 1

In the real world, we are slaves to our environment. The decisions we make are dependent on the resources available at any given time. In school, I remember coming up with a binary decision diagram (BDD) variable-ordering algorithm that relied on partial BDDs. Was that the best algorithm to determine the variable ordering of a BDD for a design? Probably not. However, it was easy to do as a coll... » read more

Memory Tradeoffs Intensify in AI, Automotive Applications
By Ann Mutschler - 14 Mar, 2019 - Comments: 0

The push to do more processing at the edge is putting a strain on memory design, use models and configurations, leading to some complex tradeoffs in designs across a variety of markets. The problem is these architectures are evolving alongside these new markets, and it isn't always clear how data will move across these chips, between devices, and between systems. Chip architectures are becom... » read more

Blog Review: Mar. 13
By Jesse Allen - 13 Mar, 2019 - Comments: 0

Mentor's Tom Fitzpatrick questions whether deep learning approaches can really help improve coverage in modern, complex designs. Cadence's Paul McLellan listens in at MWC as Huawei chairman Guo Ping defends the company's security practices and shows where its heading in 5G. Synopsys' Eric Huang checks out the newly announced USB4 specification, changes to previous USB names, and a few things ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 08 Mar, 2019 - Comments: 0

Cadence debuted Denali Gen2 IP for LPDDR5/4/4X in TSMC's 7nm FinFET process technology. The offering consists of PHY, controller and Verification IP. It supports both the pre-release LPDDR5 standard and LPDDR4/4X devices as well as Arm AMBA AXI buses and reliability features like in-line error correcting codes. The LPDDR5 standard provides up to 1.5x bandwidth over LPDDR4 and LPDDR4X. The US... » read more

How To Build An Automotive Chip
By Ann Mutschler - 07 Mar, 2019 - Comments: 0

The introduction of advanced electronics into automotive design is causing massive disruption in a supply chain that, until very recently, hummed along like a finely tuned sports car. The rapid push toward autonomous driving has changed everything. This year, Level 3 autonomy will begin hitting the streets, and behind the scenes, work is underway to design SoCs for Level 4. But how these chi... » read more

Next Wave Of Security For IIoT
By Kevin Fogarty and Ed Sperling - 07 Mar, 2019 - Comments: 0

A rush of new products and services promise to make the famously un-secured Industrial IoT (IIoT) substantially more secure in the near future. Although the semiconductor industry has been churning out a variety of security-related products and concepts, ranging from root of trust approaches to crypto processors and physically unclonable functions, most IIoT operations have been slow to adop... » read more

The Other Side Of Makimoto’s Wave
By Ann Mutschler - 06 Mar, 2019 - Comments: 0

Custom hardware is undergoing a huge resurgence across a variety of new applications, pushing the semiconductor industry to the other side of Makimoto's Wave. Tsugio Makimoto, the technologist who identified the chip industry’s 10-year cyclical swings between standardization and customization, predicted there always will be room in ASICs for general-purpose processors. But it's becoming mo... » read more

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