Development Of Planarizing Spin-On Carbon Materials For High-Temperature Processes

By Brewer Science - 20 Aug, 2020 - Comments: 0

Multilayer lithography is used for advanced semiconductor processes to pattern complex structures. As more and more procedures incorporate a high-temperature process, such as chemical vapor deposition (CVD), the need for thermally stable materials increases. For certain applications, a spin-on carbon (SOC) layer under the CVD layer is required to survive through a high-temperature process. ... » read more

June’19 Startup Funding

By Jeff Dorsch - 11 Jul, 2019 - Comments: 0

During the month of June, there were 15 startups that brought in funding rounds of $100 million or more, as investors continued to chase deals in cybersecurity, automotive technology, semiconductors, and a variety of services. There were no billion-dollar deals as spring slid into summer; yet, those 15 companies together raised a total of about $3.13 billion. Aurora Innovation, the developer... » read more

Cooperation Instead Of Competition

By Bill Neifert - 03 Jun, 2016 - Comments: 0

I spent more than 20 years working in EDA and managed to do so without ever working for one of the big three. Big EDA companies were always the competition. Oh sure, you’d partner with them strategically if you could, but always keeping in mind that little fish swimming with big fish often end up being eaten. That all changed seven months ago when ARM acquired Carbon’s technology and tea... » read more

Productivity And The IoT

By Ann Mutschler - 19 Jan, 2015 - Comments: 0

The market for devices that connect almost everything to the Internet of Things is projected to explode, creating opportunities for companies that haven’t been traditional chip developers to decide to start developing devices. Semiconductor Engineering sat down to discuss this topic with Jack Guedj, corporate VP of Tensilica products at Cadence; Bill Neifert, CTO at Carbon; Marc Evans, direct... » read more

Productivity And The IoT

By Ann Mutschler - 14 Jan, 2015 - Comments: 0

The market for devices that connect almost everything to the [getkc id="76" comment="Internet of Things"] is projected to explode, creating opportunities for companies that haven’t been traditional chip developers to decide to start developing devices. Semiconductor Engineering sat down to discuss this topic with Jack Guedj, corporate VP of [getentity id="22342" comment="Tensilica"] products ... » read more

Productivity And The IoT

By Ann Mutschler - 25 Sep, 2014 - Comments: 0

The market for devices that connect almost everything to the [getkc id="76" comment="Internet of Things"] is projected to explode, creating opportunities for companies that haven’t been traditional chip developers to decide to start developing devices. Semiconductor Engineering sat down to discuss this topic with Jack Guedj, corporate VP of Tensilica products at [getentity id="22032" e_name="... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

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3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

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Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

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Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

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The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

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tag: Carbon

Development Of Planarizing Spin-On Carbon Materials For High-Temperature Processes

June’19 Startup Funding

Cooperation Instead Of Competition

Productivity And The IoT

Productivity And The IoT

Productivity And The IoT