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A Method to Measure Die Pad Capacitance


This paper defines a method to measure the chip die pad capacitance using time delay reflectometry (TDR). This method is useful for measuring the low-value capacitance that is present at the end of a transmission line. In all protocol specifications, pad capacitance is an important electrical parameter to be measured because it directly affects the bandwidth. However, it is a challenge to me... » read more