tag: ChipAgents

Does Your RISC-V Core Meet The Standard?
By Brian Bailey - 29 Jan, 2026 - Comments: 0

Key Takeaways Architectural conformance and implementation verification are necessary but different for RISC-V designs, yet few verification engineers have experience on the conformance side. While RISC-V enables flexibility, there is a potential for ecosystem fragmentation. It is mathematically impossible to test every instruction combination, so engineers are moving beyond just "bl... » read more

Multi-Die Assemblies Require More Detailed Test Plan Earlier
By Ann Mutschler - 29 Jan, 2026 - Comments: 0

Key Takeaways Design for test takes on new urgency in complex multi-die assemblies, where it can be used to minimize downstream errors and the cost of fixing them. DFT needs to be increasingly detailed due to more connections and the inability to access some components. DFT strategies need to be developed earlier and may require multiple testing approaches. Multi-die assembl... » read more

AI’s Impact On Engineering Jobs May Be Different Than Expected
By Liz Allan - 29 Jan, 2026 - Comments: 0

Key Takeaways: AI is expected to eliminate many repetitive, entry-level tasks, but that may allow engineering students trained on the latest tools to start in more senior positions. AI is a force multiplier. It can accelerate the learning curve for junior engineers. While AI is very good at solving multi-dimensional problems, domain expertise, critical thinking, and sanity checks wil... » read more

Startup Funding: Q4 2025
By Jesse Allen - 19 Jan, 2026 - Comments: 0

The promise of AI dominated the last quarter of 2025. Investors were eager to claim stakes in both brand-new startups and more established companies developing AI-specific hardware, primarily for data centers, with over $1 billion alone flowing into the sector. The largest round of the quarter went to a new entrant aiming to fundamentally change how AI compute is performed, while two in-memory ... » read more

Will 2026 Be Dominated By AI?
By Brian Bailey - 15 Jan, 2026 - Comments: 0

Many opportunities and problems became highly interlinked in 2025, fueled by the historic growth in everything AI. But how close are we coming to breaking points, and what are people doing to mitigate them? That is the story that will unfold this year. AI's penetration into an increasing number of workloads is placing almost quadratic demands on compute, memory, interconnect, and the archite... » read more

Chip Industry Week in Review
By The SE Staff - 09 Jan, 2026 - Comments: 0

SIA's latest monthly global semiconductor sales report reflects a ~30% YOY increase, hitting a record $75.3B in November 2025. Asia Pacific had a notable 66% increase. Cadence launched its Chiplet Spec-to-Packaged Parts ecosystem to accelerate time to market for chiplet development for physical AI, data centers, and HPC applications. Initial IP partners joining Cadence include Arm, Arteris, ... » read more

Is End-To-End Security Possible?
By Ed Sperling - 08 Jan, 2026 - Comments: 0

Looming financial penalties for data breaches are forcing chipmakers to confront end-to-end security, an increasingly complex and daunting problem because no single company controls all the pieces anymore. This is especially apparent in multi-die assemblies, in use today in data centers, and under consideration in automotive and other applications. Multiple chiplets can push performance well... » read more

Chip Industry Week In Review
By The SE Staff - 02 Jan, 2026 - Comments: 0

Space Forge autonomously generated plasma aboard its ForgeStar-1 satellite, utilizing extreme low Earth orbit (LEO) conditions needed for gas-phase crystal growth of wide- and ultra-wide bandgap materials, GaN, SiC, aluminum nitride, and diamonds. Copper prices surged to a historic record of $12,600 per metric ton, an increase of more than 40% YOY, which will impact the cost of data center b... » read more

Chip Industry’s Top Videos 2025
By The SE Staff - 30 Dec, 2025 - Comments: 0

Rising complexity, new architectures, and AI's permeation of nearly everything left engineers struggling to keep up in 2025, as evidenced by this year's viewership numbers. Among the hottest topics were verification, agentic AI, DRAM/HBM, optimization of data movement, chiplets, and heterogeneous integration, but there was steady traffic growth across all sectors. Top 10 most-watched videos ... » read more

When To Move To Multi-Die Assemblies
By Ann Mutschler - 23 Dec, 2025 - Comments: 0

As chip designs become larger and more complex, especially for AI and high-performance computing workloads, it's often not feasible to fit everything onto a single planar die. But determining when to move to a multi-die assembly isn't always straightforward. Multi-die approaches have some well-documented benefits. They allow designers to split functions across different dies, which can impro... » read more

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