Why Would IBM Sell Its Semi Group?

By Ed Sperling - 20 Feb, 2014 - Comments: 1

Rumors are always just rumors until proven otherwise in business, but in the case of IBM’s semiconductor business, hints about the sale of its semiconductor business are particularly noteworthy. Much has changed since the days when IBM—as International Business Machines—went head-to-head with AT&T’s quasi-public Bell Labs and Xerox’s Palo Alto Research Center (PARC). The breakup of... » read more

The Week In Review: Oct. 11

By Mark LaPedus - 11 Oct, 2013 - Comments: 0

By Mark LaPedus & Ed Sperling Demand is running high for DRAMs, thanks to last month’s fab fire at Hynix’ China plant. “The impact from Hynix' fab fire seems to be far more extensive than we had originally thought. We now think the factory is most likely up at the earliest by May/June 2014, which certainly provides robust pricing support for DRAM. Hynix is in the process of convertin... » read more

The Week In Review: July 8

By Mark LaPedus - 08 Jul, 2013 - Comments: 0

By Mark LaPedus Fab tool vendors this week will gather at the annual Semicon West trade show in San Francisco. The mood is expected to be both gloomy and upbeat, at least based on one new and mixed forecast. The semiconductor equipment market is projected to fall 7.4% in 2013, but it will grow 27.1% in 2014, according to VLSI Research. The forecast for semis is up 10% in 2013 and 8.3% growth i... » read more

The Bumpy Road To 450mm

By Mark LaPedus - 16 May, 2013 - Comments: 0

By Mark LaPedus After its formation nearly 20 months ago, a 450mm consortium has reached its latest milestone by recently completing a cleanroom and installing the first 450mm demonstration tools in the facility. The so-called Global 450 Consortium (G450C) also has set a goal to bring 450mm fabs into high-volume manufacturing at the 10nm or 7nm nodes by 2018. That gives the industry a littl... » read more

New Processes Define New Power Plans

By Ed Sperling - 05 Apr, 2012 - Comments: 0

By Pallab Chatterjee FinFETs, stacked die, heterogeneous interposers, TSVs, 450mm wafers, new interconnects and everything with MEMs and sensors is what the last few weeks have brought. A number of major announcements, technology releases, conference updates have identified these technologies as the future of IC design. At ISQED, Robert Geer, chief academic officer at the College of Nanosca... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.