The Changing Landscape of Hardware-Based Verification And Software Development

By Frank Schirrmeister - 24 May, 2019 - Comments: 0

As the EDA is gearing up for its biggest industry event, the Design Automation Conference (DAC), this year in Las Vegas, it is interesting to observe what is going on in hardware-based development of emulation and prototyping. The trends I had outlined after last DAC in 2018—system design, cloud, and machine learning—have only grown stronger and are causing changes in the development landsc... » read more

DAC: An Exhibitor’s Perspective

By Diana Dearin - 08 May, 2019 - Comments: 0

It is less than four weeks to DAC. At this point you should be deep into your planning and ready to drop down secure all your exhibit services before the deadline. While you are thinking about how to manage all the details of getting your booth on the show floor, this is a great time to take a step back and make sure you have clearly defined exhibit “takeaways” — think “goals” and ... » read more

Week In Review: Design, Low Power

By Jesse Allen - 19 Apr, 2019 - Comments: 0

Intel acquired vision and video FPGA IP company Omnitek. Founded in 1998, the Basingstoke, England-based company has produced FPGA IP cores for video processing including conversion and enhancement, creating arbitrary image warps on a real time video stream, connectivity, and deep learning and AI inferencing. Terms of the deal were not disclosed. Qualcomm and Apple have dropped all litigatio... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: DAC2019

The Changing Landscape of Hardware-Based Verification And Software Development

DAC: An Exhibitor’s Perspective

Week In Review: Design, Low Power