tag: data analytics

Wafer Probe Struggles To Adapt To Multi-Die Assemblies
By Gregory Haley - 13 Jan, 2026 - Comments: 1

Wafer probe, one of the key processes for ensuring reliability in semiconductor manufacturing, is becoming increasingly unreliable in multi-die assemblies and at leading-edge nodes. For much of the semiconductor industry’s history, wafer probe occupied a stable, largely uncontested role in manufacturing. It was understood as a screening step, an electrical checkpoint to identify failing de... » read more

Semiconductor Manufacturing In The AI Era
By Christophe Begue - 13 Jan, 2026 - Comments: 0

At the 2025 PDF Solutions Users Conference, CEO John Kibarian delivered a wide-ranging keynote that positioned the semiconductor industry at a pivotal inflection point, one driven by explosive AI demand but constrained by unprecedented manufacturing complexity. His central message: the path to a trillion-dollar semiconductor industry by 2030 requires fundamentally rethinking how manufacturers c... » read more

The Growing Need For Collaboration Across The Semiconductor Industry
By PDF Solutions - 09 Dec, 2025 - Comments: 0

Abstract: AI-driven collaboration is becoming essential for the semiconductor industry to manage its increasingly complex global supply chain. This new model facilitates real-time data sharing and multi-party orchestration, moving beyond conventional, crisis-driven interactions. By leveraging a secure data infrastructure, automated orchestration, and AI agents, companies can automate busines... » read more

Challenges In Testing Photonics In Chips
By Ed Sperling - 21 Nov, 2025 - Comments: 0

The semiconductor industry has spent decades improving reliability and consistency by standardizing when and how to test it, how to collect critical data from those tests, and what to do with that data. But electrical test data is very different from silicon photonics, which is being bundled into these SoCs and multi-die assemblies alongside traditional electrical components. Aftkhar Aslam, CEO... » read more

Advanced Packaging Traceability And Root Cause Analysis
By Aftkhar Aslam - 20 Nov, 2025 - Comments: 0

The semiconductor industry is undergoing a profound transformation. What once centered on single-die silicon packaged in QFN or BGA formats has evolved into a landscape of multi-die integration, chiplets, 3D stacking, and photonics coupling. These advanced packaging architectures are redefining design, manufacturing, and test paradigms—enabling new levels of performance, efficiency, and funct... » read more

New Rules Put The Squeeze On Semiconductor Gray Market
By Anne Meixner - 11 Nov, 2025 - Comments: 0

The shift toward chiplets and multi-die assemblies is forcing big changes in the global supply chain, including much tighter cooperation between companies and governments to ensure the authenticity and quality of semiconductor parts. The chip industry has been looking to digital certificates as the best means of reducing counterfeiting and ensuring consistent quality for some time. The probl... » read more

The Future Of Semiconductor Manufacturing: How AI And Industry Collaboration Are Reshaping The Value Chain
By John Kibarian - 14 Oct, 2025 - Comments: 0

The semiconductor industry stands at an inflection point. As Moore's Law scaling becomes increasingly challenging and system complexity explodes through advanced packaging and chiplet-based architectures, the traditional siloed approach to manufacturing must give way to an unprecedented level of industry collaboration. This transformation, driven by the convergence of artificial intelligence, c... » read more

Hybrid Approach Emerges For Edge/Cloud Inspection Of Chips
By Anne Meixner - 14 Oct, 2025 - Comments: 0

An explosion in data from inspection images and metrology measurements is creating a confusing set of demands for chipmakers and their equipment vendors. On one hand they need the massive storage and compute resources of the cloud to utilize AI/ML-based models, but they also need the faster response time of the edge to make adjustments at the tool level. Balancing these requirements is a mas... » read more

Correlation & Commonality Analysis In Complex Semiconductor Ecosystems
By Aftkhar Aslam - 18 Sep, 2025 - Comments: 0

The semiconductor industry is entering an era defined by heterogeneous integration and complex packaging technologies. Innovations such as wafer-on-wafer bonding, chiplets, multi-stacked die (2.5D/3D), bumping, and system-in-package architectures are enabling unprecedented performance and functionality. However, with these advances comes an explosion in manufacturing complexity and ecosy... » read more

Collaboration Is Key To Growing Semiconductor Industry
By Bob Smith - 18 Sep, 2025 - Comments: 0

John Kibarian, CEO and co-founder of PDF Solutions and a member of the ESD Alliance (ESDA) Governing Council, will deliver a keynote during the CEO Summit at SEMICON West in October titled “Revolutionizing Semiconductor Collaboration: The Emergence of AI-Driven Industry Platforms.” He recently shared with me a summary of what his talk will cover and his perspective on why collabora... » read more

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