The Week In Review: Manufacturing


Chipmakers Toshiba and its fab partner, Western Digital, have jointly rolled out a 96-layer 3D NAND product amid a legal dispute. The companies have developed prototype samples of a 96-layer 3D NAND device. Samples of the new 96-layer product, which is a 256 gigabit (32 gigabytes) device, is scheduled for release in the second half of 2017 and mass production is targeted for 2018. Separately, ... » read more

The Week In Review: Manufacturing


Chipmakers The NAND market is in flux. Not long ago, troubled Toshiba put its memory unit on the block. Finally, the company has selected a group to buy its memory business. The consortium includes the Innovation Network Corp. of Japan, the Development Bank of Japan and Bain Capital. Rival SK Hynix is also part of the group. Others attempted to bid on the business, including Western Digita... » read more

Fujitsu Reorgs For Manufacturing


Fujitsu officially announced its intention of reorganizing its semiconductor manufacturing businesses, including dividing the Aizu Wakamatsu factory and Mie factory as branches of the foundry companies. The rest of the organization, including the system memory department and Fujitsu Electronics will become a part of Fujitsu’s semiconductor group. The new Foundry Company will also be a part of... » read more