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Establishing Connectivity Between Die and BGA


The BGA component serves the primary role of redistributing the signals from the die it protects to an interface pattern (the BGA’s balls) compatible with the host PCB it mounts on. As a result, many IC package designs are among those who do not use a front-end schematic. Even if you have a schematic, you may find yourself making logic swaps in the layout where the additional context of the r... » read more