Hybrid Bonding Basics: What Is Hybrid Bonding?


Hybrid bonding is the key to paving an innovative future in advanced packaging. Hybrid bonding provides a solution that enables higher bandwidth and increased power and signal integrity. As the industry is looking to enhance the performance of final devices through scaling system-level interconnections, hybrid bonding provides the most promising solution with the ability to integrate several di... » read more

Stacked Die Changes


Semiconductor Engineering sat down to discuss advanced packaging with David Pan, associate professor in the department of electrical and computer engineering at the University of Texas; Max Min, senior technical manager at Samsung; John Hunt, senior director of engineering at ASE; and Sitaram Arkalgud, vice president of 3D portfolio and technologies at Invensas. What follows are excerpts of tha... » read more