Domain-Specific Design Drives EDA Changes

By Ann Mutschler - 03 Jan, 2022 - Comments: 0

The chip design ecosystem is beginning to pivot toward domain-specific architectures, setting off a scramble among tools vendors to simplify and optimize existing tools and methodologies. The move reflects a sharp slowdown in Moore's Law scaling as the best approach for improving performance and reducing power. In its place, chipmakers — which now includes systems companies — are pushing... » read more

IC Security Threat Grows As More Devices Are Connected

By Ann Mutschler - 06 May, 2021 - Comments: 0

Designing for security is beginning to gain traction across a wider swath of chips and systems as more of them are connected to the Internet and to each other, sometimes in safety- and mission-critical markets where the impact of a cyber attack can be devastating. But it's also becoming more difficult to design security into these systems. Unlike in the past, connectivity is now considered e... » read more

Week In Review: Design, Low Power

By Jesse Allen - 13 Mar, 2020 - Comments: 0

Tools & IP Synopsys revealed DSO.ai (Design Space Optimization AI), an autonomous AI application that searches for optimization targets in very large solution spaces of chip design, inspired by the process of DeepMind's game-playing AlphaZero. DSO.ai engines ingest large data streams generated by chip design tools and use them to explore search spaces, observing how a design evolves over t... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 06 Mar, 2020 - Comments: 0

Pervasive computing — health An injectable biosensor may someday help measure signs of influenza. DARPA (the U.S. Department of Defense’s Defense Advanced Research Projects Agency) and digital health startup Profusa announced a study that uses Profusa’s Lumee Oxygen Platform to find ways to identify flu outbreaks, biological attacks and pandemics as much as three weeks earlier than curre... » read more

The Week in Review: IoT

By Jeff Dorsch - 23 Feb, 2018 - Comments: 0

Finance Vectra raised $36 million in Series D funding led by Atlantic Bridge Capital. The Ireland Strategic Investment Fund and Nissho Electronics also participated in this funding round along with returning investors Khosla Ventures, Accel Partners, IA Ventures, AME Cloud Ventures, DAG Ventures, and Wipro Ventures, bringing Vectra’s total funding to date to $123 million. Vectra will use the... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.