Encapsulating Wearable Sensors Using A Pre-Mixed Two-Part Epoxy


By Anthony Buzzerio, Venkat Nandivada, and Rohit Ramnath The growing field of wearable medical technology relies heavily on miniaturized sensors capable of providing accurate and continuous physiological data. Ensuring the long-term reliability and performance of these sensors — often subjected to demanding conditions including physical stress, thermal fluctuations, and exposure to bodily ... » read more

Nanoimprint-Based Dielectric Patterning for Fine-Pitch Hybrid Bonding (Seoul National Univ. of Science and Technology)


A new technical paper titled "Hybrid Bonding with Polymeric Interlayer Dielectric Layers Patterned by Nanoimprint Lithography" was published by researchers at Seoul National University of Science and Technology. Abstract "Recent advancements in semiconductor technology have shifted the focus of innovation toward advanced packaging technologies featuring heterogeneous integration. Among thes... » read more

Impact Modifiers and Compatibilizers for Versatile Epoxy-Based Adhesive Films with Curing and Deoxidizing Capabilities


Abstract: "Epoxy resins with acidic compounds feature adhesion, robustness, and deoxidizing ability. In this study, hybrid adhesive films with deoxidizing and curing capabilities for semiconductor packaging were fabricated. The compatibilizing effects and mechanical properties were chiefly investigated by using various additive binders (thermoplastic amorphous polymers) and compatibilizing a... » read more