Tech Talk: Power Issues Ahead


Aveek Sarkar, vice president of technology and support at ANSYS Apache, talks with Low-Power Engineering about growing concerns over electrostatic discharge, electromigration, the impact of stacked die, and the need for power and thermal models. [youtube vid=-7TtszsuZP0] » read more

Reliability Verification For Smart ICs


By Arvind Shanmugavel The electronic brains behind today’s advanced systems are smart ICs, paving the way for consumer electronics, energy, biomedical, automotive and avionics industries. Power efficiency and system integration are keys to the success of these smart systems. The IC industry has swiftly responded with state-of-the-art low-power techniques and chip integration initiatives f... » read more

The Shocking Side Of 3D


By Ann Steffora Mutschler The pesky static charge that builds up on your clothing when you forget the dryer sheet is more than just a nuisance when it comes to manufacturing ICs. Add 3D structures and process scaling to the mix and the challenge of adequately protecting those devices grows significantly. While this problem used to be largely an afterthought, the charged-device model type of... » read more

Changes In The Ecosystem


By Ed Sperling For the better part of two decades, semiconductor companies have been talking about ecosystems mostly for marketing and economic reasons. They’re now talking thinking about ecosystems for complex technology reasons that involve integrated models for power, transactions and manufacturability. In the late 1990s, IBM began assembling its own loose ecosystem as a way of shieldi... » read more

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