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The Week In Review: Manufacturing


Manufacturing United States President Barack Obama has announced the winner of the New Smart Manufacturing Innovation Institute and manufacturing hub competition. The winner is the Smart Manufacturing Leadership Coalition (SMLC). This coalition, headquartered in Los Angeles, Calif., brings together a consortium of nearly 200 partners from across academia, industry and non-profits. The idea is... » read more

The Road To 5nm


There is strong likelihood that enough companies will move to 7nm to warrant the investment. How many will move forward to 5nm is far less certain. Part of the reason for this uncertainty is big-company consolidation. There are simply fewer customers left who can afford to build chips at the most advanced nodes. Intel bought Altera. Avago bought Broadcom. NXP bought Freescale. GlobalFoundrie... » read more

IC Industry Waking Up To Security


By Jeff Dorsch & Ed Sperling Many people pay lip service to the concept of security in Internet of Things devices, software, and networks. That oversight is beginning to fade away, however, as companies begin digging into one of the broadest and most complex problems in the IoT age. Unlike other technology issues, which have been solved in increments, security is all-inclusive. While ... » read more

Inside The SRC


Semiconductor Engineering sat down to talk with Ken Hansen, the new president and chief executive of the Semiconductor Research Corp. (SRC), a U.S.-based technology research consortium. Prior to joining the SRC in May, Hansen was vice president and chief technology officer at Freescale. What follows are excerpts of that conversation. SE: My impression is that the SRC allocates funding for va... » read more

The Week In Review: Design/IoT


Mergers & Acquisitions Zuken acquired one of its USA resellers, electrical applications provider Caetek. The company also developed software for harness manufacturers that integrated with Zuken's electrical wiring, control systems and fluid engineering toolset. The NXP-Freescale merger is, at last, official. The largest revenue source for the combined company will be automotive, proje... » read more

Can The IoE Ever Be Secure?


There are many different opinions about how the [getkc id="76" comment="Internet of Things"]/[getkc id="260" comment="Internet of Everything"] ultimately will look, who is best positioned to take advantage of it, and how processing will be split between local devices, the cloud, and everything in between. But there is almost universal agreement on one point: It's not secure enough. "In the p... » read more

Anything As A Service


Everything as a service promises to simplify our lives, from cutting edge business to consumer applications. It is too early to tell, but the concept of everything moving to the cloud poses some interesting issues, from bandwidth to security. Who would have guessed that in 2015, launching a business would require virtually no physical assets? You simply turn on your computer and everything y... » read more

Consolidation’s Aftermath


The recent spate of industry consolidation continues to have repercussions across the semiconductor industry. Some of those effects will subside once the deals are either approved or nixed by regulatory agencies. Others will raise questions for months or years to come. Consolidation is not a new trend in the semiconductor industry, but the pace and size of the acquisitions in the past year a... » read more

The Week In Review: Design/IoT


NXP received all necessary regulatory approvals for the merger with Freescale, and the sale of its RF Power business to JAC Capital. The company now expects to close the merger on December 7. Synopsys introduced VIP to support the proposed IEEE P802.3bs/D1.0 Ethernet 400G standard. The VIP includes a native SystemVerilog UVM architecture, protocol-aware debug and source code test suites. ... » read more

Why Packaging Matters


The semiconductor package is changing. What was until very recently considered an afterthought is now becoming a key part of the design process at all major chipmakers, and a critical factor in the extension of Moore's Law. This is a sharp reversal of what was almost universally an afterthought in planar silicon design and manufacturing. Rarely was the package an integral part of the archite... » read more

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