Microelectronics And The AI Revolution

By Frank Schirrmeister - 23 Sep, 2021 - Comments: 0

It is no secret that artificial intelligence and machine learning (AI/ML) are critical drivers for growth in electronics, and particularly, for semiconductors. The recent AI Hardware Summit showcased trends in AI/ML, both in enabling and using it in various application domains, including EDA. As part of the summit, Imec had organized a panel on “Advanced Microelectronics Technologies Driving ... » read more

Edge-Inference Architectures Proliferate

By Bryon Moyer - 04 Feb, 2021 - Comments: 0

First part of two parts. The second part will dive into basic architectural characteristics. The last year has seen a vast array of announcements of new machine-learning (ML) architectures for edge inference. Unburdened by the need to support training, but tasked with low latency, the devices exhibit extremely varied approaches to ML inference. “Architecture is changing both in the comp... » read more

Startup Funding: November 2020

By Jesse Allen - 02 Dec, 2020 - Comments: 0

Numerous chipmakers pulled in funding in November 2020, with investors putting money into interconnects, memories, AI hardware, and quantum computing. Launching from stealth was a startup aiming to combine AI and 5G. Autonomous delivery did well, too, with one company raising a massive $500M. This month, we take a look at 28 companies that raised a collective $1.1B. Semi & design Connec... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: GrAI Matter Labs

Microelectronics And The AI Revolution

Edge-Inference Architectures Proliferate

Startup Funding: November 2020