Chip Industry Technical Paper Roundup: May 5


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations Rethinking Compute Substrates for 3D-Stacked Near-Memory LLM Decoding: Microarchitecture-Scheduling Co-Design 🔗 Univ. of Edinburgh, Peking Univ., Cambridge, CAS, HKUST In-SoIC ESD Protection for Chiplet-Based 3D Microsystems: Future Research Direct... » read more

Government Funding For Chip Design Tools Spreads


Governments around the globe are starting to invest more heavily in chip design tools and related research as part of an effort to boost on-shore chip production, opening new opportunities for startups and established EDA companies. Those cash infusions, which are being doled out in the U.S., Europe, and Asia, are part of a growing recognition of the importance of design automation tools wit... » read more