tag: IEEE

Week In Review: Manufacturing, Test
By Mark LaPedus - 14 Sep, 2018 - Comments: 0

Fab/mask manufacturing An alliance of companies have formed the Center for Deep Learning in Electronics Manufacturing (CDLe). NuFlare, Mycronic and D2S have established the San Jose, Calif.-based center to advance the state-of-the-art in deep learning for its industry-specific applications. Imec.xpand, an early-stage and growth fund that is initiated by Imec, has closed its first fund at 11... » read more

Week In Review: Design, Low Power
By Jesse Allen - 07 Sep, 2018 - Comments: 0

Cadence teamed up with nine PCB manufacturing partners on an ecosystem to provide easier access to partners' technology files to improve PCB manufacturability. The program, DesignTrue DFM, allows for automated import of a manufacturer's latest DFM rules as well as rule checking in real time as part of the PCB layout process. The nine initial PCB manufactures supporting the program are: Bay Area... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 27 Jul, 2018 - Comments: 0

Trade issues China and the United States are embroiled in a trade war. What is the impact? In testimony submitted to the Office of the United States Trade Representative (USTR) on the proposed tariffs on Chinese products, Consumer Technology Association (CTA) Vice President of International Trade Sage Chandler argues tariffs negatively impact businesses and consumers as well as fail to corr... » read more

Week In Review: Design, Low Power
By Jesse Allen - 13 Jul, 2018 - Comments: 0

M&A Intel will acquire fabless company eASIC. Founded in 1999, eASIC sells structured ASIC platforms that act as a midpoint between FPGAs and standard cell ASICs by combining FPGA-like logic and design flows with single via routing. Eventually, Intel sees potential in using its Embedded Multi-Die Interconnect Bridge (EMIB) technology to combine Intel FPGAs with structured ASICs in a system... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 22 Jun, 2018 - Comments: 0

Chipmakers Intel has announced the resignation of Brian Krzanich as chief executive and a member of the board. The board has named Chief Financial Officer Robert Swan as interim chief executive, effective immediately. Intel was recently informed that Krzanich had a “past consensual relationship” with an Intel employee. This is a violation of Intel’s non-fraternization policy, which ap... » read more

Advanced Packaging Confusion
By Ed Sperling - 13 Jun, 2018 - Comments: 2

Advanced packaging is exploding in all directions. There are more chipmakers utilizing different packaging options, more options for the packages themselves, and a confusing array of descriptions and names being used for all of these. Several years ago, there were basically two options on the table, 3D-ICs and 2.5D. But as chipmakers began understanding the difficulty, cost and reduced benef... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 08 Jun, 2018 - Comments: 0

Fab tools Applied Materials has launched a suite of products that will enable cobalt metallization schemes for contacts and interconnects in chips at advanced nodes. The products from Applied enable a complete cobalt fill process. The tools include CMP, CVD, PVD and RTP systems. At advanced nodes, cobalt promises to reduce unwanted resistance in the critical parts of a chip. Cobalt is bein... » read more

The Week In Review: Design
By Jesse Allen - 08 Jun, 2018 - Comments: 0

Tools & IP Synopsys added machine learning capabilities to its Design Platform. The company highlighted benefits to the PrimeTime signoff tool, which saw 5X faster power recovery in customer designs at leading-edge geometries. Renesas is using the tool, noting a 4X power ECO speed-up. ArterisIP unveiled a standalone last level cache (LLC) for high-performance SoCs. CodaCache can be adde... » read more

Designing Hardware For Security
By Ed Sperling - 09 May, 2018 - Comments: 1

By Ed Sperling and Kevin Fogarty Cyber criminals are beginning to target weaknesses in hardware to take control of devices, rather than using the hardware as a stepping stone to access to the software. This shift underscores a significant increase in the sophistication of the attackers, as evidenced by the discovery of Spectre and Meltdown by Google Project Zero in 2017 (made public in Ja... » read more

The Week In Review: Design
By Jesse Allen - 20 Apr, 2018 - Comments: 0

M&A The ESD Alliance is merging with SEMI, becoming a SEMI Strategic Association Partner. SE Editor In Chief Ed Sperling argues that the merger has broad implications for the chip industry, particularly as smaller nodes require greater collaboration between design and manufacturing. Meanwhile, SEMI president and CEO Ajit Manocha explains why the combining will be of benefit to members of b... » read more

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