Chiplets Enter The Supercomputer Race

By Mark LaPedus - 17 Mar, 2022 - Comments: 0

Several entities from various nations are racing each other to deliver and deploy chiplet-based exascale supercomputers, a new class of systems that are 1,000x faster than today’s supercomputers. The latest exascale supercomputer CPU and GPU designs mix and match complex dies in advanced packages, adding a new level of flexibility and customization for supercomputers. For years, various na... » read more

System Bits: Sept. 11

By Jeff Dorsch - 11 Sep, 2019 - Comments: 0

Everything’s faster in Texas The Frontera supercomputing system was formally unveiled last week at the Texas Advanced Computing Center. The system was deployed in June on the University of Texas at Austin campus. It is the fifth-fastest supercomputer in the world at present and the world's fastest academic supercomputer. Dell EMC and Intel collaborated on fitting out Frontera. Work beg... » read more

Nvidia to Buy Mellanox for $6.9B

By Jeff Dorsch - 11 Mar, 2019 - Comments: 0

Nvidia reached a definitive agreement to acquire Mellanox Technologies for $125 a share in cash, giving the deal an enterprise value of about $6.9 billion. The proposed transaction would complement Nvidia’s product portfolio in high-performance computing for applications in artificial intelligence and big data analytics, with Mellanox’s specialty in providing interconnects for hyperscale da... » read more

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Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

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Chiplets Enter The Supercomputer Race

System Bits: Sept. 11

Nvidia to Buy Mellanox for $6.9B

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