Inside The OSAT Business


Semiconductor Engineering sat down to discuss the IC-packaging industry, foundries, China and other topics with Tien Wu, chief operating officer at Taiwan's Advanced Semiconductor Engineering (ASE), the world's largest outsourced semiconductor assembly and test (OSAT) vendor. What follows are excerpts of that conversation. SE: What is your overall outlook for 2016? Wu: Last year, the semi... » read more

Manufacturing Bits: March 15


More multi-beam The multi-beam e-beam market is a hot topic. For example, Intel is quietly in the process of acquiring IMS Nanofabrication, a developer of multi-beam e-beam tools for mask writing applications. Meanwhile, at the recent SPIE Advanced Lithography conference, Mapper Lithography disclosed new upgrades for its multi-beam e-beam tool for use in direct-write lithography application... » read more

New Memory Approaches And Issues


New memory types and approaches are being developed and tested as DRAM and Moore's Law both run out of steam, adding greatly to the confusion of what comes next and how that will affect chip designs. What fits where in the memory hierarchy is becoming less clear as the semiconductor industry grapples with these changes. New architectures, such as [getkc id="202" kc_name="fan-outs"] and [getk... » read more

The Week In Review: Manufacturing


In a surprising move, Intel is quietly in the process of acquiring IMS Nanofabrication, a developer of multi-beam e-beam tools for mask writing applications, Semiconductor Engineering has learned. With the deal, Intel is moving into uncharted territory by buying a semiconductor equipment company. In the past, though, the chip giant has invested in equipment vendors, such as ASML, Nikon and... » read more

Verification Facing Unique Inflection Point


The Design and Verification Conference and Exhibition (DVCon) attracted more than 1,100 people to San Jose last week, just slightly less than last year. While a lot of focus, and most of the glory, goes to design within semiconductor companies, it is verification where most of the advancements are happening and thus the bigger focus for DVCon. The rate of change in verification and the producti... » read more

How Many Cores? (Part 1)


The optimal number of processor cores in chip designs is becoming less obvious, in part due to new design and architectural options that make it harder to draw clear comparisons, and in part because just throwing more cores at a problem does not guarantee better performance. This is hardly a new problem, but it does have a sizable list of new permutations and variables—right-sized heteroge... » read more

The Week In Review: Manufacturing


Is robotics the next big thing? IDC forecasts that global spending on robotics and related services will grow at a compound annual growth rate (CAGR) of 17% from more than $71 billion in 2015 to $135.4 billion in 2019. "Robotics is one of the core technologies that is enabling significant change in manufacturing through factory of the future initiatives. While traditionally used in the automoti... » read more

The Price Of Fear


Fear sells, and judging from the attendance numbers and the messages coming out of this week's RSA Conference, it's selling quite well. Increasing connectedness comes at a significant price, and apparently lots of people are willing to pay that price. Security has become a huge and growing business. Attendance is one indicator. There were an estimated 40,000 attendees at this year's conferen... » read more

Manufacturing Bits: March 1


Gravitational-wave observatories India has approved the construction of the world’s third gravitational-wave observatory. This facility will replicate the two Laser Interferometer Gravitational-wave Observatories (LIGOs) in the United States, which recently detected the world's first gravitational waves. The Indian project, dubbed LIGO-India, is expected to go online in 2023. The effort b... » read more

The Week In Review: Manufacturing


What was the mood at this week’s SPIE Litho? “EUV sentiment is improving among chipmakers as ASML makes progress toward HVM metrics; however, there is still much hedging around timing and readiness. We view EUV adoption as likely to be slow and gradual through 2020,” said Weston Twigg, an analyst with Pacific Crest Securities, in a report. “In order for ASML to hit the higher levels of ... » read more

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