Planning For Physical Effects


The importance of Intel’s announcement that it has perfected 3D transistors and will roll them out this year should not be understated. This is a major breakthrough technologically, with major implications for power, performance and even competitiveness. FinFETs have been the subject of some intensive research for more than a decade, with the University of California at Berkeley leading the c... » read more

The Enterprise Effect


By Pallab Chatterjee In the enterprise it’s all about speed and power—as in more speed and less power—and those changes are forcing shifts in the chip architectures as well as the processes used to develop those chips. At the Linley Data Center Conference the next generation of network control chips were discussed. The keys for the new networks are 10G data lanes to be used with 10G/4... » read more

No More Netlist Hacking


By Ann Steffora Mutschler Prior to availability of advanced physical verification tools, it was not uncommon for engineering teams to hack netlists. It sounds very clandestine, but was done out of the need to get detailed information on particular areas of the chip suspected to be a problem. Performing electrical rules checks (ERC) to improve the correctness and reliability of IC designs b... » read more

Hot Potatoes


Matching hardware to software, and software to hardware, is an interesting discussion. It’s also one that usually happens at a very high-level of abstraction, which renders many of the conclusions less than helpful. The software stack is not a single thing. It’s a group of things, all incredibly complex in their own right and increasingly in need of some very detailed integration. The fa... » read more

Embedded Computing Down To Two Major Camps


By Pallab Chatterjee The 2011 CES show was highlighted by the large number of tablet computers and mobile devices that support Internet access. The form factor for these devices is based on use models, but the computing capabilities are based on the power and operational life between charges. The platforms are drawing diving lines between x86 cores vs ARM cores, and CPUs vs GPUs. While on t... » read more

Embedded Computing Down To Two Major Camps


By Pallab Chatterjee The 2011 CES show was highlighted by the large number of tablet computers and mobile devices that support Internet access. The form factor for these devices is based on use models, but the computing capabilities are based on the power and operational life between charges. The platforms are drawing diving lines between x86 cores vs ARM cores, and CPUs vs GPUs. While on t... » read more

ARM Vs. Intel


Simon Segars, ARM's executive vice president and general manager of the company's physical IP group, talks about the war with Intel and which markets it's likely to affect. [youtube vid=EISi5qpY77M] » read more

ARM’s Race


Prior to the Synopsys acquisition of Virage Logic, Synopsys seemed to have an almost exclusive relationship with ARM. Since then, Cadence and Mentor Graphics have both been cutting deals with ARM for support of its IP cores. What’s changed? With regard to the Virage Logic acquisition, very little. Synopsys did acquire the ARC processor through that deal, but ARC had been much more focused ... » read more

Deep Dive: Energy Efficient Ethernet


By Pallab Chatterjee In late September, the IEEE ratified the 802.3az Energy Efficient Ethernet (EEE) specification. The standard, and associated test certification specification, was supported by co-development of over 20 commercial products from multiple vendors, of which 13 were release to market simultaneous with the ratification. Wael Diab, from the office of the CTO at Broadcom, and ... » read more

Getting Ready For 15nm


By David Lammers The trends towards vertical transistors, non-silicon channel materials, and resistive RAMs promise to hold center stage at the 2010 IEEE International Electron Devices Meeting (IEDM), set to begin Dec. 6 in San Francisco, Calif. (www.ieee-iedm.org) Taiwan Semiconductor Manufacturing Co. (TSMC, Hsinchu, Taiwan) will present a 22/20nm technology platform based on a FinFET arc... » read more

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