tag: interconnect

Not Enough Respect For SoC Interconnect
By K. Charles Janac - 30 Jul, 2018 - Comments: 0

For high-volume system-on-chip (SoC) applications—artificial intelligence (AI), automotive, mobility, solid state drives and more—effective interconnect technology can generate hundreds of millions of dollars in revenue due to smaller chip area, better functionality and faster delivery of SoC platforms. State-of-the-art interconnect technology also allows chip designers to create SoC deriva... » read more

Neural Nets In ADAS And Autonomous Driving SoC Designs
By Kurt Shuler - 26 Apr, 2018 - Comments: 0

Automotive electronics has ushered in a new wave of semiconductor design innovation and one new technology gaining a lot of attention is neural networks (NNs). Advanced driving assistance systems (ADAS) and autonomous car designs now rely on NNs to meet the real-time requirements of complex object-recognition algorithms. The concept of NNs has been around since World War II, promising a futu... » read more

How SoC Interconnect Enables Flexible Architecture For ADAS And Autonomous Car Designs
By Kurt Shuler - 22 Feb, 2018 - Comments: 0

When the mobile phone era saw its fastest growth, the design teams that were the most innovative were able to introduce game-changing features before anyone else. Those companies also had the most configurable interconnect IP, allowing them to adapt to quickly changing market needs faster than their competition. Now, nearly a decade later, when autonomous driving is quickly moving into the m... » read more

New Interconnect Makes eFPGA Dense And Portable
By Geoff Tate - 02 Nov, 2017 - Comments: 0

FPGAs were invented over 30 years ago. Today they are much bigger and faster, but their basic architecture remains unchanged: logic blocks formed around LUTs (look-up-tables) in a sea of mesh (x/y grid) interconnect with a matrix of switches at every “intersection.” One FPGA company executive once said they don’t really sell programmable logic, they sell programmable interconnect, beca... » read more

The Week In Review: Design
By Jesse Allen - 06 Oct, 2017 - Comments: 0

M&A Altair acquired Runtime Design Automation. Founded in 1995, Runtime provides tools for optimizing usage of EDA tools, including flow management, job scheduling, and license utilization, as well as tools for optimizing HPC network resources. Altair's focus is on engineering simulation, with tools for HPC resource management and IoT data analytics. Terms of the deal were not disclosed. ... » read more

Boldly Go Where No NoC Has Gone Before
By Rajesh Ramanujam - 25 May, 2017 - Comments: 0

Functional safety, at varying degrees of integrity and with or without the ISO 26262, has become a cornerstone of SoCs in many key market segments, not just automotive. And the industry goal is to achieve these reliability levels without sacrificing any PPA and while continually reducing TTM. Go figure! I know, that’s like saying, make me an omelet without breaking eggs. And egg substitute is... » read more

Making Interconnects Faster
By Mehul Naik - 22 May, 2017 - Comments: 3

In integrated circuits, interconnect resistance is a combination of wire and via resistance. Wire resistance of a conductor depends on several factors, one of which is the electron scattering at various surfaces and grain boundaries. Via resistance, on the other hand, is a function of the thickness or resistivity of the layers at the bottom of the via through which current must travel. T... » read more

System Performance Analysis At ARM
By Arm - 07 Dec, 2016 - Comments: 0

Performance analysis is a vital task in modern SoC design. An under-designed SoC may run too slowly to keep up with the demands of the system. An over-designed SoC will consume too much power and require more expensive IP blocks. At ARM we want to help our partners build SoCs that deliver the best performance within their power and area budgets. The simple truth is that this is more difficul... » read more

Interconnect Challenges Rising
By Mark LaPedus - 27 Jun, 2016 - Comments: 1

Chipmakers are ramping up their 14nm finFET processes, with 10nm and 7nm slated to ship possibly later this year or next. At 10nm and beyond, IC vendors are determined to scale the two main parts of the [getkc id="185" kc_name="finFET"] structure—the transistor and interconnects. Generally, transistor scaling will remain challenging at advanced nodes. And on top of that, the interconnects ... » read more

Electromigration: Not Just Copper Anymore
By Katherine Derbyshire - 31 May, 2016 - Comments: 2

While integrated circuit manufacturers have worried about electromigration for a long time, until recently most of their concerns have focused on the on-chip interconnects. The larger dimensions found in integrated circuit packages have, in most cases, improved heat dissipation, reduced current density, and eliminated most [getkc id="160" kc_name="electromigration"] risks. Over the last sev... » read more

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