Image Processing For Vision AI

By Renesas - 23 Feb, 2022 - Comments: 0

Recent years have seen an increasing need for Vision AI applications using AI to enable real-time image recognition. Vision AI, which substitutes AI for human visual recognition, requires optimal image processing. Renesas has released RZ/V2M as mid-class, and RZ/V2L as an entry class, Vision AI microprocessors (MPUs). Both products are equipped with DRP-AI which is Dynamically Reconfigurable Pr... » read more

Have Processor Counts Stalled?

By Brian Bailey - 24 Sep, 2020 - Comments: 2

Survey data suggests that additional microprocessor cores are not being added into SoCs, but you have to dig into the numbers to find out what is really going on. The reasons are complicated. They include everything from software programming models to market shifts and new use cases. So while the survey numbers appear to be flat, market and technology dynamics could have a big impact in resh... » read more

The Week in Review: IoT

By Jeff Dorsch - 20 Apr, 2018 - Comments: 0

Cybersecurity The U.S. and U.K. governments collaborated on an unprecedented message on Monday, together warning that Russian cyberattacks may extend beyond government and private organizations to individual homes and offices. The attacks may focus on Internet of Things devices, said Rob Joyce, the cybersecurity coordinator for the National Security Council, who soon after resigned from the Wh... » read more

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Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

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Image Processing For Vision AI

Have Processor Counts Stalled?

The Week in Review: IoT

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