Voltage Regulation Moves Into The Package


Integrated circuits require a variety of voltages and a wide range of currents, typically supplied by voltage regulators. But increasing power density is resulting in higher power delivery losses. Moving those regulators closer to the chips they power can reduce those losses. Co-packaging them holds the most promise, but it comes with challenges. “What people have been talking about, ev... » read more

Four Vertical Power Delivery Architectures For Emerging Packaging and Integration Platforms (UIC)


A technical paper titled “Vertical Power Delivery for Emerging Packaging and Integration Platforms – Power Conversion and Distribution” was published by researchers at University of Illinois Chicago. Abstract: "Efficient delivery of current from PCB to point-of-load (POL) is a primary concern in modern high-power high-density integrated systems. Traditionally, a 48 V power signal is con... » read more