LAB Flip Chip Reflow Process Robustness Prediction By Thermal Simulation

By Gabriel Chang - 16 Nov, 2023 - Comments: 0

By Gabriel Chang and Ricky Zang Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) of solder joints is a widely adapted and stable process in the industry. The applications of MR include flip chip, ball mounting, surface mount technology (SMT), ... » read more

Reverse Laser Assisted Bonding (R-LAB) Technology For Chiplet Module Bonding On Substrate

By SeokHo Na - 21 Sep, 2023 - Comments: 0

By SeokHo Na, MinHo Gim, GaHyeon Kim, DongSu Ryu, DongJoo Park, and JinYoung Kim In the recent semiconductor market, there are many applications including smartphone, tablets, central processing units (CPUs), artificial intelligence (AI), data cloud and more that are expecting and experiencing rapid growth. As most of these applications require high performance, single-die Flip Chip packages... » read more

Next Gen Laser Assisted Bonding (LAB) Technology

By SeokHo Na - 18 May, 2023 - Comments: 0

In the semiconductor market, there are many applications including smartphone, tablets, central processing units (CPUs), artificial intelligence (AI), data cloud and more that are expecting rapid growth. Among them, CPU data processing, AI and data cloud require much higher power consumption than smart phones or tablets. For the higher power applications, Flip Chip ball grid array (FCBGA) or 2.... » read more

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tag: laser assisted bonding

LAB Flip Chip Reflow Process Robustness Prediction By Thermal Simulation

Reverse Laser Assisted Bonding (R-LAB) Technology For Chiplet Module Bonding On Substrate

Next Gen Laser Assisted Bonding (LAB) Technology

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