MicroLEDs Move Toward Commercialization

By Laura Peters - 29 Aug, 2022 - Comments: 1

The market for MicroLED displays is heating up, fueled by a raft of innovations in design and manufacturing that can increase yield and reduce prices, making them competitive with LCD and OLED devices. MicroLED displays are brighter and higher contrast than their predecessors, and they are more efficient. Functional prototypes have been developed for watches, AR glasses, TVs, signage, and au... » read more

MicroLEDs Moving From Lab to Fab

By Laura Peters - 22 Jul, 2021 - Comments: 1

Every disruptive technology has its "aha" moment — the time when everyone from engineers to investors realizes that, yes, this technology is the real deal and it won’t be scrapped on the R&D floor. For many, it was Samsung’s recent announcement of a 110-inch microLED TV that irrevocably put microLEDs on the map. The TV’s price is $155,000, but as with most consumer electronics th... » read more

Week in Review: IoT, Security, Autos

By Jeff Dorsch - 23 Aug, 2019 - Comments: 0

Products/Services Huawei Technologies is again delaying the public introduction of its Mate X foldable smartphone. It is unlikely the product will be marketed in the U.S., given the ongoing trade war. The official rollout now seems likely to come in November, in time for the holiday shopping season. Samsung Electronics has had its problems with foldable phones, yet those were due to manufactur... » read more

Power/Performance Bits: April 17

By Jesse Allen - 17 Apr, 2018 - Comments: 0

Flexible LCDs Researchers at Donghua University and Hong Kong University of Science and Technology developed a flexible, optically rewriteable LCD for paperlike displays. The team estimates it will be cheap to produce, perhaps only costing $5 for a 5-inch screen. Optically rewriteable LCDs, like conventional LCDs, are structured like a sandwich, with a liquid crystal filling between two ... » read more

What’s Next In Mobile Displays

By Mark LaPedus - 17 Dec, 2015 - Comments: 0

The next wave of smartphones and wearables is invading the market. These systems will feature a new class of high-resolution displays, and in the near future displays will become foldable and rollable, although there are still some challenges with this technology. To be sure, mobile display technology is advancing on several fronts. On one front, for example, Apple and other systems vendor... » read more

System Bits: Nov. 18

By Ann Mutschler - 18 Nov, 2014 - Comments: 0

Phase transitions between liquid, gas Researchers from the University of Tokyo and Tokyo Institute of Technology reminded that materials change their form between three states -- solid, liquid, and gas -- depending on factors such as temperature and pressure. However, a phase transition does not necessarily occur between liquid and gas, and they can continuously transform from the one to the o... » read more

Power/Performance Bits: May 6

By Ann Mutschler - 06 May, 2014 - Comments: 0

Boosting image quality UCLA researchers have created a device based on a new material and manufacturing process that they say could lead to a significant leap in the quality of images on smartphones, computer displays, TVs and inkjet printers. The new material and manufacturing process are used to produce semiconductors that are essential to LCDs and organic light-emitting diode (OLED) disp... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.