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Manufacturing Bits: March 3


Security lithography At the recent SPIE Advanced Lithography conference, Multibeam disclosed more details about its efforts to develop multi-beam direct-write lithography for chip security applications. David Lam, chief executive and chairman of Multibeam, described how multi-beam lithography can be used to help thwart IC counterfeiting and tampering in the market. This lithography technolo... » read more

Litho Options For Panel Fan-out


Several packaging houses are inching closer to production of panel-level fan-out packaging, a next-generation technology that promises to reduce the cost of today’s fan-out packages. In fact, ASE, Nepes, Samsung and others already have installed the equipment in their panel-level fan-out lines with production slated for 2018 or so. But behind the scenes, panel-level packaging houses contin... » read more