What’s Next In Scaling, Stacking

An Steegen, executive vice president of semiconductor technology and systems at [getentity id="22217" e_name="Imec"], sat down with Semiconductor Engineering to discuss IC scaling, chip stacking, packaging and other topics. Imec is an R&D organization in Belgium. What follows are excerpts of that conversation. SE: Chipmakers are shipping 16nm/14nm processes with 10nm and 7nm technologies... » read more