tag: Mentor

Context-Aware SPICE Simulation Improves The Fidelity Of ESD Analysis
By Neel Natekar - 10 Feb, 2022 - Comments: 0

Electrostatic discharge (ESD) is a major reliability concern for integrated circuit (IC) designs. ESD verification is proving to be a significant challenge at advanced nodes, due to growing IC design complexity and transistor counts. Traditional ESD verification approaches using parasitic extraction followed by SPICE simulation are deficient in providing simulation results in a practical runtim... » read more

Spreadsheets: Still Valuable, But More Limited
By Brian Bailey - 10 Feb, 2022 - Comments: 1

Spreadsheets have been an invaluable engineering tool for many aspects of semiconductor design and verification, but their inability to handle complexity is squeezing them out of an increasing number of applications. This is raising questions about whether they still have a role, and if so, how large that role will be. There are two sides to this issue. On one side are the users who see them... » read more

Design Challenges Increasing For Mixed-Die Packages
By Ann Mutschler - 09 Feb, 2022 - Comments: 0

The entire semiconductor ecosystem is starting to tackle a long list of technology and business changes that will be needed to continue scaling beyond Moore's Law, making heterogeneous combinations of die easier, cheaper, and more predictable. There are a number of benefits to mixing die and putting them together in a modular way. From a design standpoint, this approach provides access to th... » read more

SoC Power Methodology: Are We Lean Enough
By Siemens EDA - 09 Feb, 2022 - Comments: 0

It’s interesting how past lessons learned have such relevance in today’s quest for an optimum system-on chip (SoC) power methodology. Lean manufacturing was introduced by the Toyota Motor Corporation in the 1930s. It is now an essential methodology in most manufacturing and industrial settings. As lean methodology evolved, it extended to software development where its principles have led to... » read more

Blog Review: Feb. 9
By Jesse Allen - 09 Feb, 2022 - Comments: 0

Arm's Mark Inskip walks through how the Morello program built a demonstration of the architecture that enables fine-grained memory protection and highly scalable software compartmentalization based on the CHERI (Capability Hardware Enhanced RISC Instructions) architectural model, from IP development and SoC design to creating software and a demonstration board. Synopsys' Plamen Asenov and su... » read more

Smart DFT Infrastructure And Automation Are Key To Managing Design Scaling
By Siemens EDA - 08 Feb, 2022 - Comments: 0

This paper describes how using a smarter DFT infrastructure and automation can greatly improve the DFT schedule. A structural DFT infrastructure based on plug-and-play principles is used to enable concurrent DFT development and integration. DFT automation is used to connect and manage the DFT infrastructure to dramatically reduce the risks associated with design scaling and complexity. Highe... » read more

Unknowns Driving Up The Cost Of Auto IC Reliability
By Ed Sperling - 08 Feb, 2022 - Comments: 2

Automotive chipmakers are considering a variety of options to improve the reliability of ICs used for everything from sensors to artificial intelligence. But collectively they could boost the number of process steps, increase the time spent in manufacturing and packaging, and stir up concerns about the amount of data that needs to be collected, shared, and stored. Accounting for advanced pro... » read more

What Causes Semiconductor Aging?
By Bryon Moyer - 08 Feb, 2022 - Comments: 7

Semiconductor technology has evolved to the point where no one can assume chips will last forever. If not carefully considered, aging can shorten the life of an IC below the needs for an intended application. Aging is well studied in technology circles, but while others less directly involved may understand at a general level this is a problem, it's not always obvious why. So what exactly ar... » read more

Simplify DFT For Advanced SoCs
By Ron Press - 08 Feb, 2022 - Comments: 0

The purpose of electronic design automation (EDA) software is to solve SoC design problems and simplify the entire process. For design for test (DFT), this means aiming to streamline the DFT development for today’s large and complex designs. The technologies and methods developed through partnerships between EDA suppliers, foundries, and semiconductor companies should effectively reduce risk,... » read more

Do You Know For Sure Your RISC-V RTL Doesn’t Contain Any Surprises?
By Joseph Hupcey III - 03 Feb, 2022 - Comments: 0

Given the relative novelty and complexity of RISC-V RTL designs, whether you are buying a commercially supported core or downloading a popular open-source offering, there is the small but non-zero risk of unwanted surprises escaping undetected into your end-product. In order of high-to-low probability, consider: The presence of a weird-yet-entirely-possible corner-case bug Bugs “insid... » read more

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