tag: Mentor

Trimming Waste In Chips
By Brian Bailey - 12 Oct, 2017 - Comments: 0

Extra circuitry costs money, reduces performance and increases power consumption. But how much can really be trimmed? When people are asked that question they either get defensive or they see it as an opportunity to show the advantages of their architecture, design process or IP. The same holds true for IP suppliers. Others point out that the whole concept of waste is somewhat strange, becau... » read more

Noise Abatement
By Brian Bailey - 12 Oct, 2017 - Comments: 0

[getkc id="285" kc_name="Noise"] is a fact of life. Almost everything we do creates noise as a by-product and quite often what is a signal to one party is noise to another. Noise cannot be eliminated. It must be managed. But is noise becoming a larger issue in chips as the technology nodes get smaller and packaging becomes more complex? For some, the answer is a very strong yes, while for ot... » read more

Automated Body Bias Validation For High Performance, Low Power Electronics
By Mentor, a Siemens Business - 11 Oct, 2017 - Comments: 0

Using a device’s body bias effect allows designers to tune a circuit’s behavior to meet both power and performance specifications, but getting it right isn’t always easy. Accurate, fast, automated body bias verification is critical to ensure today’s complex designs meet demanding performance, reliability, and power usage specifications. To read more, click here. » read more

Blog Review: Oct. 11
By Jesse Allen - 11 Oct, 2017 - Comments: 0

Mentor's Matthew Balance examines the separation of concerns between test intent and test realization in the Portable Stimulus specification. Synopsys' Deepak Nagaria checks out the features that makes LPDDR4 efficient in terms of power consumption, bandwidth utilization, data integrity and performance. Cadence's Meera Collier listens in as Chris Rowen considers whether AI processing shou... » read more

Improving Yield, Reliability With Data
By Ann Mutschler - 11 Oct, 2017 - Comments: 0

Big data techniques for sorting through massive amounts of data to identify aberrations are beginning to find a home in semiconductor manufacturing, fueled by new requirements in safety-critical markets such as automotive as well as the rising price of packaged chips in smartphones. Outlier detection—the process of finding data points outside the normal distribution—isn't a new idea. It ... » read more

True Costs Of Process Node Migration
By Mentor, a Siemens Business - 09 Oct, 2017 - Comments: 0

Deciding when and how to make a process node transition is critical to business success. The solution that requires the least amount of total change—in the form of license configurations, required hardware resources, necessary tool qualifications, and adequate support infrastructure—will always be the most “inexpensive” option. Do you have all the information you need to make the right ... » read more

IoT Security: Technology Is Only One Part Of The Equation
By Warren Kurisu - 05 Oct, 2017 - Comments: 0

Survey after survey on the adoption of the IoT punctuates that security and data privacy continue to be the top concerns with any new implementation. It used to be that security was all about protecting data (business, personal ID, etc.), but as more devices are connected to the IoT, security concerns reach far beyond just the value inherent in the data. According to Gartner, nearly 5.5 ... » read more

Functional Safety Issues Rising
By Ed Sperling - 05 Oct, 2017 - Comments: 0

Developing semiconductors for safety-critical markets such as automotive, industrial and medical involves a growing list of extra steps that need to be taken pre- and post-manufacturing to ensure product integrity, reliability and security. This is causing several significant changes: • Designs are becoming much more complicated because they require such features as failover and redundan... » read more

Fusing CMOS IC And MEMS Design For IoT Edge Devices
By Mentor, a Siemens Business - 04 Oct, 2017 - Comments: 0

Creating a sensor-based IoT edge device is challenging, due to the multiple design domains involved (Analog, digital, RF, and MEMS). But, creating an edge device that combines the electronics using the traditional CMOS IC flow and a MEMS sensor on the same silicon die can seem impossible. In fact, many IoT edge devices combine multiple dies in a single package, separating electronics from the M... » read more

Starting Point Is Changing For Designs
By Ed Sperling - 04 Oct, 2017 - Comments: 0

The starting point for semiconductor designs is shifting. What used to be a fairly straightforward exercise of choosing a processor based on power or performance, followed by how much on-chip versus off-chip memory is required, has become much more complicated. This is partly due to an emphasis on application-specific hardware and software solutions for markets that either never existed befo... » read more

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