Thermal-Mechanical Optimization of 2.5D Flip-Chip Packages With Glass and Silicon Interposers (Univ. of Ottawa)


A new technical paper titled "Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via finite element analysis and machine learning" was published by researchers at University of Ottawa. Abstract "Advanced 2.5D flip-chip packages with silicon/glass interposers may pose tightly coupled thermo-mechanical trade-offs. This work presents a simulation-driven, ... » read more

Moving Past “It Works” — Intelligent Optimization Is the Key to PCB Excellence


In the fast-evolving field of electronic systems design, engineers are under increasing pressure to deliver innovative, high-performance products within ever-shrinking development cycles. Traditional methods—relying on intuition, trial-and-error testing, and even basic simulation—struggle to keep pace with the growing complexity of modern systems. Nowhere is this more evident than in printe... » read more

SLX Multi-Objective Optimization (MOPT)


Technologies such as autonomous cars and 5G communication are seeing a rapid increase in the number of processing elements (PE) per platform. Where software professionals were used to programming one, two or a handful of cores, the game has now changed. Intel’s Many Integrated Core Architecture [3] contains up to 78 cores, Nvidia Tegra XI[2] has up to 260 cores and Adapteva’s Epiphany-V[1] ... » read more