Technical Paper Round-Up: March 22


New memories, materials, and transistor types, and processes for making those devices, highlighted the past week's technical papers. That includes everything from vertical MoS2 to programmable black phosphorus image sensors and photonic lift-off processes for flexible thin-film materials. Papers continue to flow from all parts of the supply chain, with some new studies out of Pakistan, Seoul... » read more

Key Recovery for Content Protection Using Ternary PUFs Designed with Pre-Formed ReRAM


RESEARCH PAPER Abstract "Physical unclonable functions, embedded in terminal devices, can be used as part of the recovery process of session keys that protect digital files. Such an approach is only valuable when the physical element offers sufficient tamper resistance. Otherwise, error correcting codes should be able to handle any variations arising from aging, and environmentally induce... » read more

Week in Review: IoT, Security, Auto


Internet of Things At Arm TechCon, Arm unveiled its Neoverse brand identity, providing an infrastructure foundation for 5G, the Internet of Things, edge computing, and other applications. The Arm Neoverse IP will proliferate next year from Arm and its technology partners. With Arm’s “Ares” platform, to be introduced in 2019, the company promises to deliver 30% per-generation performance ... » read more