Week in Review: IoT, Security, Autos

By Jeff Dorsch - 26 Jul, 2019 - Comments: 0

Products/Services Siemens announced that Mazda Motor adopted the Capital electrical design software suite from Mentor, a Siemens Business, for the design of next-generation automotive electrical systems. Mazda is said to use Capital for model-based generative design for the electrical and electronic systems of the entire vehicle platform. Synopsys will host the 11th annual Codenomi-con USA ... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 28 Sep, 2018 - Comments: 0

Internet of Things IBM this week launched the Watson Decision Platform for Agriculture, which combines artificial intelligence, Internet of Things technology, and cloud-based offerings, providing insights to farmers through a managed service. Among other features, growers can deploy drones to send photos to the IBM Cloud for AI-based trend analysis and detection of crop diseases. The platform ... » read more

The Week in Review: IoT

By Jeff Dorsch - 12 Jan, 2018 - Comments: 0

Anniversaries The Bluetooth Special Interest Group is celebrating its 20th anniversary this year, and it kicked off the commemoration at CES 2018. The group now has more than 33,000 corporate members. Products/Services Samsung Electronics used the CES 2018 event to report on its progress in Internet of Things products and services. The company’s SmartThings technology now connects 370 ce... » read more

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Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: Nozomi Networks

Week in Review: IoT, Security, Autos

Week in Review: IoT, Security, Auto

The Week in Review: IoT

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