Week in Review: IoT, Security, Auto

By Jeff Dorsch - 17 Aug, 2018 - Comments: 0

Cybersecurity Check Point Software Technologies reports that facsimile machines (yes, people still use them!) can be subject to hacking through vulnerabilities in their communication protocols. The HP Officejet Pro All-in-One fax printers and other fax machines can be compromised with a hacker only knowing a fax number, according to the company. Check Point Research says a design flaw in Andro... » read more

The Road To Autonomy

By Jeff Dorsch - 01 Feb, 2018 - Comments: 0

Visions of autonomous driving were everywhere at CES 2018 in Las Vegas and the North American International Auto Show in Detroit. Still, while there is progress in the technology, it will be years before the average motorist can get a fully autonomous vehicle. Advanced driver-assistance systems are gaining in complexity and scope, representing steps toward automated driving. At CES 2018, ... » read more

Aftermarket Autonomous Vehicle Race Heats Up

By Ann Mutschler - 06 Oct, 2016 - Comments: 0

It’s not just car companies that are racing to build self-driving vehicles. An entire ecosystem is sprouting up around retrofitting existing vehicles with autonomous technology, despite the fact that the technology, infrastructure, regulatory and insurance issues are still not fully formed. Uber already is using self-driving taxis, accompanied by a human driver, in Pittsburgh, Pa. And many... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: nuTonomy

Week in Review: IoT, Security, Auto

The Road To Autonomy

Aftermarket Autonomous Vehicle Race Heats Up