Week In Review: Manufacturing, Test


OEMs and chipmakers Apple has reduced its revenue outlook to $84 billion for the quarter, down from $89 billion to $93 billion in its original forecast. The consensus on Wall Street was $91 billion. “The guide down was mostly attributed to weaker-than-expected iPhone demand in emerging markets, predominantly China,” said John Vinh, an analyst with KeyBanc Capital Markets, in a research not... » read more

Fab Equipment Challenges For 2019


After a period of record growth, the semiconductor equipment industry is facing a slowdown in 2019, in addition to several technical challenges that still need to be resolved. Generally, the equipment industry saw enormous demand in 2017, and the momentum extended into the first part of 2018. But then the memory market began deteriorating in the middle of this year, causing both DRAM and NAND ... » read more

Week In Review: Manufacturing, Test


Chipmakers GlobalFoundries has announced that its advanced silicon-germanium (SiGe) offering is available for prototyping on 300mm wafers. GF’s SiGe technology has been shipping on its 200mm production line in Burlington, Vt. The technology, a 90nm SiGe process, is moving to 300mm wafers at GF’s Fab 10 facility in East Fishkill, N.Y. The SiGe technology is called 9HP. “The increasing ... » read more

What’s The Outlook for Memory?


What a difference a year makes in the memory business. At this time last year, the industry was in the midst of a boom cycle for both NAND and DRAM. More specifically, there was huge demand for 3D NAND. Then, starting in the first quarter of 2018, the NAND market began to decline and it continues to fall. And now, the DRAM market is also falling off the cliff. So, it’s time to take a q... » read more

3D NAND Flash Wars Begin


3D NAND suppliers are gearing up for a new battle amid a period of price and competitive pressures, racing each other to the next technology generations. Competition is intensifying as a new player enters the 3D NAND market—China’s Yangtze Memory Technologies Co. (YMTC). Backed by billions of dollars in funding from the Chinese government, YMTC recently introduced its first 3D NAND techn... » read more

Next-Gen Memory Ramping Up


The next-generation memory market is heating up as vendors ramp a number of new technologies, but there are some challenges in bringing these products into the mainstream. For years, the industry has been working on a variety of memory technologies, including carbon nanotube RAM, FRAM, MRAM, phase-change memory and ReRAM. Some are shipping, while others are in R&D. Each memory type is di... » read more

Embedded Flash Scaling Limits


Embedded nonvolatile flash memory has played a key role in chips for years, but the technology is beginning to face some scaling and cost roadblocks and it’s not clear what comes next. Embedded flash is used in several markets, such as automotive, consumer and industrial. But the automotive sector appears to be the most concerned about the future of the technology. Typically, a car incorpo... » read more

Blog Review: Dec. 13


Mentor's Sherif Hany notes that pattern matching isn't just for litho hotspots anymore, and is increasingly being used in a wide range of early design phase checks, DRC flows, layout retargeting and fixing and DFM checks. Synopsys' Eric Huang explains why USB cables have gotten so short, even though no length is mentioned in the specification. Cadence's Paul McLellan listens in as Jeremy ... » read more

The Week In Review: Manufacturing


Fab tools In a move to expand its product portfolio, Lam Research has acquired Coventor, a provider of simulation and modeling solutions for the semiconductor and MEMS industries. Lam Research held an analyst event at the recent Flash Memory Summit. The topics included 3D NAND and other technologies. In a blog, here’s what executives from Lam said at the event. Analysts from RBC Cap... » read more

5 Takeaways From Semicon


At the recent Semicon West trade show in San Francisco, there were a multitude of presentations on a number of subjects. The event, sponsored by SEMI, had presentations on the outlook for ICs, equipment and packaging. Clearly, though, the show is much smaller with fewer attendees, as compared to past years. Most of the big companies no longer have booths. Hardly any have press events or med... » read more

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