tag: On Semiconductor

SiC Chip Demand Surges
By Mark LaPedus - 20 Sep, 2018 - Comments: 0

The silicon carbide (SiC) power semiconductor market is experiencing a sudden surge in demand amid growth for electric vehicles and other systems. But the demand also is causing a tight supply of SiC-based devices in the market, prompting some vendors to add fab capacity in the midst of a tricky wafer-size transition. Some SiC device makers are transitioning from 4- to 6-inch wafers in the f... » read more

Blog Review: Aug. 22
By Jesse Allen - 22 Aug, 2018 - Comments: 0

Cadence's Paul McLellan considers how much further we need to go to make EUV work for 5nm, the problem of cost, and ASML's EUV roadmap. In a video, Mentor's Colin Walls explains optimizing data in embedded software with a simple example of two ways to put data in memory and how to decide which is best. Synopsys' Fred Bals provides a rundown of the different types of application security t... » read more

Progress And Chaos On Road To Autonomy
By Jeff Dorsch - 03 Jun, 2018 - Comments: 1

Progress in the development of fully autonomous vehicles is incremental and slow, but not for lack of effort. Research and development in self-driving cars is under way all around the globe, from the biggest automotive manufacturers and their Tier 1 suppliers to companies not traditionally involved in the automotive industry. Add to that fleets of startups working on sensor technologies and ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 11 May, 2018 - Comments: 0

Test and packaging In a major surprise, Cohu has entered into a definitive agreement to acquire Xcerra for approximately $796 million. With the deal, Cohu will enter the ATE market. Last year, a group from China entered into a definitive agreement under which it would acquire Xcerra. But the U.S. blocked Xcerra’s sale to the Chinese group. Ironically, at one time, Cohu was reportedly lobbyin... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 30 Mar, 2018 - Comments: 0

Chipmakers 3D NAND continues to gain steam, but is the industry headed towards a capacity glut in the overall NAND market? Time will tell. In any case, Toshiba is moving forward with its plans to invest in its Fab 6 facility in Japan. The fab will produce the company’s 96-layer 3D NAND devices. Then, Samsung plans to invest $7 billion to double the production capacity for NAND flash memor... » read more

Blog Review: Jan. 24
By Jesse Allen - 24 Jan, 2018 - Comments: 0

Mentor's Rich Edelman shares some tips for debugging complex UVM testbenches containing multiple agents, multiple checkers, and new HDL. Synopsys' Prasad Subudhi K. S. explains the PCIe PIPE 4.4.1 specification and the major improvements since 4.3, including better optimization in data flow and ultra-low power operations. Cadence's Paul McLellan steps back to before the Meltdown and Spect... » read more

The New Road Warriors
By Jeff Dorsch - 27 Nov, 2017 - Comments: 0

Chip vendors and other companies that have little or no experience in automotive are flooding into this market as the race for assisted and autonomous driving begins to heat up. This market is expected to pay big dividends for companies that succeed in helping to build the vehicles of the future in this century. IC Insights earlier this year forecast the auto chip market would grow 22% this ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 13 Oct, 2017 - Comments: 0

Materials and equipment A scandal has rocked Japan’s Kobe Steel. The company disclosed that it has falsified inspection data for iron powder, aluminum and copper products that were sent to over 200 customers in the automotive, electronics, transportation and other sectors. The falsified data involves 20,000 tones of products, according to reports. Kobe apologized for the issues and provided ... » read more

Blog Review: Sept. 13
By Jesse Allen - 13 Sep, 2017 - Comments: 0

Mentor's Andrew Macleod points to some important things to consider when beginning an automotive IC project and why differentiation, not commoditization, should be the goal. Synopsys' Amit Paunikar examines the architecture changes that make LPDDR4 faster while consuming less power. Cadence's Paul McLellan shares highlights from CDNLive Boston, from the latest in silicon photonics to how ... » read more

Blog Review: Sept. 6
By Jesse Allen - 06 Sep, 2017 - Comments: 0

Mentor's Jeff Miller explains why hardware security is important for IoT edge devices, where vulnerabilities lie today, and how researchers created an undetectable backdoor attack circuit. Cadence's Meera Collier argues that while AI is getting good at many things, composing music is not yet one of them. Synopsys' Robert Vamosi considers the state of voting machine security as security re... » read more

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