A Flip-Chip, Co-Packaged With Photodiode, High-speed TIA in 16nm FinFET CMOS

By Technical Paper Link - 20 Jul, 2023 - Comments: 0

A technical paper titled "A 112-Gb/s —8.2-dBm Sensitivity 4-PAM Linear TIA in 16-nm CMOS With Co-Packaged Photodiodes" was published by researchers at University of Toronto, Alphawave IP, and Huawei Technologies Canada. Abstract: "A flip-chip co-packaged linear transimpedance amplifier (TIA) in 16-nm fin field effect transistor (FinFET) CMOS demonstrating 112-Gb/s four-level pulse-amplitude... » read more

Reservoir Computing based on Mutually Injected Phase Modulated Semiconductor Lasers as a Monolithic Integrated Hardware Accelerator

By Technical Paper Link - 08 Feb, 2022 - Comments: 0

Abstract: "In this paper we propose and numerically study a neuromorphic computing scheme that applies delay-based reservoir computing in a laser system consisting of two mutually coupled phase modulated lasers. The scheme can be monolithic integrated in a straightforward manner and alleviates the need for external optical injection, as the data can be directly applied on the on-chip phase m... » read more

Integrated Photonics (Part 1)

By Brian Bailey - 30 Aug, 2017 - Comments: 0

Semiconductor Engineering sat down to discuss the status of integrated photonics with Twan Korthorst, CEO for PhoeniX Software; Gilles Lamant, distinguished engineer for [getentity id="22032" e_name="Cadence"]; Bill De Vries, director of marketing for Lumerical Solutions; and Brett Attaway, director of EPDA solutions at AIM Photonics, SUNY Polytechnic Institute. What follows are excerpts of tha... » read more

System Bits: Oct. 27

By Ann Mutschler - 27 Oct, 2015 - Comments: 0

Uncovering a novel phase of matter In a finding that could have implications for high-temperature superconductivity, a team of physicists led by David Hsieh, assistant professor of physics at Caltech has discovered an unusual phase of matter that is characterized by an unusual ordering of electrons. The researchers said this finding offers possibilities for new electronic device functionali... » read more

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tag: optical communications

A Flip-Chip, Co-Packaged With Photodiode, High-speed TIA in 16nm FinFET CMOS

Reservoir Computing based on Mutually Injected Phase Modulated Semiconductor Lasers as a Monolithic Integrated Hardware Accelerator

Integrated Photonics (Part 1)

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tag: optical communications

A Flip-Chip, Co-Packaged With Photodiode, High-speed TIA in 16nm FinFET CMOS

Reservoir Computing based on Mutually Injected Phase Modulated Semiconductor Lasers as a Monolithic Integrated Hardware Accelerator

Integrated Photonics (Part 1)

System Bits: Oct. 27

Trending Articles

NAND Flash Targets 1,000 Layers

One Chip Vs. Many Chiplets

FOPLP Gains Traction in Advanced Semiconductor Packaging

HBM Options Increase As AI Demand Soars

Asia Government Funding Surges

Knowledge Centers Entities, people and technologies explored

Related Articles

Shift Left Is The Tip Of The Iceberg

Partitioning In The Chiplet Era

NAND Flash Targets 1,000 Layers

3.5D: The Great Compromise

AI’s Role In Chip Design Widens, Drawing In New Startups

What Comes After HBM For Chiplets

Memory Fundamentals For Engineers

New AI Processors Architectures Balance Speed With Efficiency

Sponsors

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