Analyzing The U.S. Advanced Packaging Ecosystem With Countermeasures To Mitigate HW Security Issues


A technical paper titled “US Microelectronics Packaging Ecosystem: Challenges and Opportunities” was published by researchers at University of Florida, University of Miami, and Skywater Technology Foundry. Abstract: "The semiconductor industry is experiencing a significant shift from traditional methods of shrinking devices and reducing costs. Chip designers actively seek new technologica... » read more