Manufacturing Bits: Sept. 12

Failure analysis for 2.5D/3D chips Imec has developed a new failure analysis method to localize interconnection failures in 2.5D/3D stack die with through-silicon vias (TSVs). This technique is called LICA, which stands for light-induced capacitance alteration. It addresses the reliability issues for 2.5D/3D devices in a non-destructive and cost-effective manner at the wafer level. For s... » read more

The Week In Review: IoT

Finance Trend Micro, the cybersecurity firm, announced a corporate venture fund of $100 million to invest in emerging technology markets, including the Internet of Things. Gartner estimates 26 billion devices will be connected to the Internet by 2020. Products Cisco Jasper introduced the Control Center 7.0 IoT connectivity management platform, with advanced capabilities, premium services, ... » read more