Week In Review: Auto, Security, Pervasive Computing

By Liz Allan - 14 Jul, 2023 - Comments: 0

Google was hit with a class action suit in U.S. District Court in San Francisco, alleging data scraping from millions of users without consent and violation of copyright laws to train and develop its AI products. Last month, the same law firm filed a suit against OpenAI for ChatGPT. Despite calling for a pause on development of advanced AI in March, Elon Musk launched xAI, a new company focu... » read more

Chip Industry’s Technical Paper Roundup: July 12

By Liz Allan - 12 Jul, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=117 /] (more…) » read more

An Advanced Modeling Approach For Cyclic Safety Mechanisms In A Fault Tree Analysis

By Technical Paper Link - 08 Jul, 2023 - Comments: 0

A technical paper titled "Best Practices for Advanced Modeling of Safety Mechanisms in an FTA" was published by researchers at University of Stuttgart, Robert Bosch GmbH, Audi AG, and Porsche AG. Abstract: "To cope with the megatrends electrification, automated driving, and connectivity, new functionalities and electric and/or electronic systems must be developed, which require a safe power s... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Porsche AG

Week In Review: Auto, Security, Pervasive Computing

Chip Industry’s Technical Paper Roundup: July 12

An Advanced Modeling Approach For Cyclic Safety Mechanisms In A Fault Tree Analysis