中文 English

Manufacturing Bits: Oct. 26


GaN finFETs, scaling GaN At the upcoming IEEE International Electron Devices Meeting (IEDM) in San Francisco, a slew of entities will present papers on the latest technologies in R&D. The event, to be held Dec. 11–15, involve papers on advanced packaging, CMOS image sensors, interconnects, transistors, power devices and other technologies. At IEDM, Intel will present a paper on a GaN-... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive SGS-TÜV Saar certified that Cadence’s Tensilica Xtensa processors with FlexLock meets the ISO 26262:2018 standard to ASIL-D level. The new FlexLock feature is key to the certification because it supports lockstep, a fault-tolerant method that runs the same operation on two cores at the same time and then compares the output. Any difference in the output can be examined for issues... » read more

Manufacturing Bits: July 13


Heterogenous III-V packaging At the recent 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), a group presented a paper on the development of a wafer-level fan-out package using heterogenous III-V devices. This paper deals with the packaging of two III-V chips for use in RF transceiver applications in base stations. III-V Lab, CEA-Leti, Thales and United Monolithic Semic... » read more

The Good And Bad Of Auto IC Updates


Keeping automobiles updated enough to avoid problems is becoming increasingly difficult as more complex electronics are added into vehicles, and as the lifetimes of those devices are extended to a decade or more. Modern vehicles are full of electronics. In fact, the value of electronic devices used in modern vehicles is expected to double in the next 10 years, growing to $469 billion by 2030... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs IBM has unveiled what the company says is the world’s first 2nm chip. The device is based on a next-generation transistor architecture called a nanosheet FET. The nanosheet FET is an evolutionary step from finFETs, which is today’s state-of-the-art transistor technology. Targeted for 2024, IBM’s 2nm chip features a novel multi-Vt scheme, a 12nm gate length, and a n... » read more

Week In Review: Auto, Security, Pervasive Computing


Pervasive computing — IoT, edge, cloud, data center, and back Foxconn (also known as Hon Hai Technology Group) is forming a joint venture (JV) with Yageo Group, a component production and process management company for EVs and other high-end electronics, to focus on the development of semiconductors under $2 USD, which they call “small ICs.” Through the JV, a new company called XSemi wil... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive/Mobility With the chip supply so tight it is shutting down automotive production lines, U.S. chip company CEOs signed a Semiconductor Industry Association (SIA) letter asking the U.S. president to include funding incentives for the chip manufacturing in U.S. economic recovery plans. The letter references the CHIPS for America Act and asks the president to work with Congress to suppo... » read more

Week In Review: Manufacturing, Test


Market research For some time, China has faced an enormous trade gap in semiconductors. In response, China has been developing its semiconductor industry with plans to make more of its chips. But China is expected to fall far short of its “Made in China 2025” goals for IC production, according to IC Insights. “IC Insights forecasts China-produced ICs will represent only 19.4% of its I... » read more

Emerging Apps And Challenges For Packaging


Advanced packaging is playing a bigger role and becoming a more viable option to develop new system-level chip designs, but it also presents chipmakers with a confusing array of options and sometimes a hefty price tag. Automotive, servers, smartphones and other systems have embraced advanced packaging in one form or another. For other applications, it's overkill, and a simpler commodity pack... » read more

Week In Review: Manufacturing, Test


Fab tools PDF Solutions has entered into a definitive agreement to acquire Cimetrix. Under the terms, PDF will pay a cash amount of $35.0 million, net of cash on Cimetrix’s balance sheet as of closing, and subject to other closing adjustments. With the move, PDF will expand into new markets. Cimetrix is a provider of equipment connectivity products for smart manufacturing and Industry 4.0... » read more

← Older posts