tag: Quantum Global Technologies

Chip Industry Week In Review

By The SE Staff - 03 Jul, 2026 - Comments: 0

Around the world South Korea unveiled a sweeping AI and semiconductor investment drive, planning three mega projects that tie semiconductors, physical AI/robotics, and AI data centers into a single industrial plan, with government support for regional chip clusters, packaging capacity, power, water, sites, and workforce development. Among the new investments: Samsung will spend $260B on n... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 27 Jul, 2018 - Comments: 0

Trade issues China and the United States are embroiled in a trade war. What is the impact? In testimony submitted to the Office of the United States Trade Representative (USTR) on the proposed tariffs on Chinese products, Consumer Technology Association (CTA) Vice President of International Trade Sage Chandler argues tariffs negatively impact businesses and consumers as well as fail to corr... » read more

Trending Articles

Chip Industry Week In Review

Onsemi to buy Synaptics; IBM's 7Å chip w/40% more SRAM area; 1nm MoS2 nanotubes; AI pressure points; memory updates; $250M CHIPS Act award; trade secret theft; new advanced packaging site; MEMS capacity; humanoids; earnings.

by The SE Staff

Chip Industry Week In Review

S. Korea goes All In on AI; new Dresden power fab; Intel expansion; GM secures memory supply; AI power management funding; mature-node foundry capacity; 300mm fab equipment; McKinsey's map of strategic IC supply; security threats; AI burnout.

by The SE Staff

Executive Outlook: Agentic AI’s Impact On Chip Design

Can engineers trust AI to get everything right in semiconductor design and verification?

I/O Design Challenges Grow In AI Data Centers And HPC Clusters

Physical I/Os can be a chokepoint for high-performance chips and high-speed interconnect protocols, requiring design tradeoffs and extra reliability measures.

Chip Industry Week In Review

Intel's expansion; Cadence AI super agent for PCB, advanced packaging; photonics fab wars; earlier Yongin fab; German funding; new CHIPS Act award; HBM standard; Quadric funding; AMS acquisition; earnings; Rapidus teams up.

by The SE Staff

Knowledge Centers
Entities, people and technologies explored

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