Side-Channel Attacks Make Devices Vulnerable


As the world begins to take security more seriously, it becomes evident that a device is only as secure as its weakest component. No device can be made secure by protecting against a single kind of attack. Hypervisors add a layer of separation between tasks making sure that one task cannot steal secrets from another. Protection of the JTAG port is necessary to prevent access underneath the h... » read more

Lower Power Plus Better Performance


The tradeoff between power and performance is becoming less about one versus the other, and more about a dual benefit, as new computing and chip architectures begin rolling out. Neural networking, which is one of the hot buttons for any system that relies on lots of distributed sensors, is essential to get a true picture of what is happening around a car moving down the highway at 65 miles ... » read more

From The Data Center To The Mobile Edge


At the heart of the Internet of Things is the complex interplay between the needs for both low power and high performance (LPHP), a perplexing challenge rooted in the de-facto bifurcation of the IoT itself. For example, lower power mobile devices, systems and lite endpoints make up the vast majority of forward-facing consumer infrastructure, while high-performance servers at the back end are ta... » read more

Seeing The Future Of Vision


Vision systems have evolved from cameras that enable robots to “see” on a factory floor to a safety-critical element of the heterogeneous systems guiding autonomous vehicles, as well as other applications that call for parallel processing technology to quickly recognize objects, people, and the surrounding environment. Automotive electronics and mobile devices currently dominate embedded... » read more

Blog Review: Oct. 12


Mentor's Harry Foster digs into verification technology adoption trends for ASIC/IC. Cadence's Tom Anderson looks at the goals of the Portable Stimulus Working Group and how they compare to those of UVM. Synopsys' Eric Huang checks out what's new in the land of USB, Type-C adoption, and cable testing. Ansys' Aveek Sarkar explores the challenges facing 7nm designs and the benefits of ch... » read more

The Week In Review: Design


Tools Synopsys updated RSoft, its software for the design of photonic devices. The updates include increased integration with the company's TCAD products as well as faster simulations and additional ways to customize photonic device analysis. IP Mentor Graphics, Northwest Logic, and Krivi Semiconductor collaborated on DDR4 SDRAM IP to integrate design and verification into a single flo... » read more

DDoS Attacks Highlight Need For IoT Security


A massive wave of distributed denial-of-service (DDoS) attacks executed against security researchers and hosting companies has captured headlines over the past few weeks. For example, OVH was targeted by two concurrent DDoS attacks at a combined bandwidth of almost 1 terabit per second, with one attack peaking at 799Gbps. According to reports, the attacks centered on Minecraft servers hosted... » read more

Blog Review: Oct. 5


Mentor's Michael White explores why established nodes are experiencing such an unexpectedly long lifespan and how that is driving new challenges for designers. Cadence's Ann Keffer checks out the history of Ethernet and how it won the battle to become the dominant network protocol. Is your IoT device fueling a botnet? Vulnerable firmware on internet connected devices was behind one of the... » read more

Blog Review: Sept. 28


Cadence's Paul McLellan provides a glimpse of TSMC's roadmap, including what to look for at 7nm, low-power processes, and the ecosystem around the process. Mentor's Stephen Pateras notes that throughout the evolution of DFT, two rules for success have persisted. Early analysis suggests the largest DDoS attack in history, targeted at security reporter Brian Krebs, may have leveraged flaws ... » read more

The Week In Review: Manufacturing


Fab tools and T&M Applied Materials and the Institute of Microelectronics (IME), a research institute under the Agency for Science, Technology and Research (A*STAR), have announced a five-year extension of their R&D collaboration at the Centre of Excellence in Advanced Packaging in Singapore. The organizations will expand the scope of their R&D collaboration to focus on advancing fan-out wafer... » read more

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