tag: Renesas

Week In Review: Manufacturing, Design, Test
By Mark LaPedus - 21 Feb, 2014 - Comments: 0

Reports have surfaced that IBM’s semiconductor unit is on the block, and there has been discussion about the reasons and the aftermath. Sources say there are at least two potential buyers for the unit—Samsung and TowerJazz. Apparently, the talks between IBM-Samsung and IBM-TowerJazz have been going on for some time. Multiple sources believe that Samsung is interested in buying IBM’s advan... » read more

Week In Review: Manufacturing, Design, Test
By Mark LaPedus - 31 Jan, 2014 - Comments: 0

The technology of 3D "bioprinting" (the medical application of 3D printing to produce living tissue and organs) is advancing so quickly that it will spark a major ethical debate on its use by 2016, according to Gartner. At the same time, 3D printing of non-living medical devices such as prosthetic limbs, combined with a burgeoning population and insufficient levels of healthcare in emerging mar... » read more

Week In Review: Manufacturing, Design, Test
By Mark LaPedus - 24 Jan, 2014 - Comments: 0

Look for a nasty political campaign in Idaho, according to Bloomberg. Business leaders from Micron Technology and others in Idaho are endorsing the incumbent Republican candidate over a Tea Party challenger. The challenger, Bryan Smith, is a conservative Republican running for Idaho’s second congressional district. He is running against 16-year incumbent Mike Simpson. Simpson is supposedly pr... » read more

Inside Japan: The Applied Materials-Tokyo Electron Merger
By Semiconductor Portal - 14 Oct, 2013 - Comments: 0

The merger of Tokyo Electron and Applied Materials has turned heads around the globe, but behind the scenes in Japan there was a recognition that this deal had to be done now or it would never be possible. Releases from both companies describe it as a merger of equals, and the Japanese press has reported it that way. But international media outside of Japan take the view that Tokyo Electron ... » read more

The Week In Review: Sept. 13
By Ed Sperling - 13 Sep, 2013 - Comments: 0

By Ed Sperling Cadence unveiled its next-generation emulation platform, greatly boosting the speed by up to 60x for embedded OS verification and by up to 10x for hardware/software verification. Overall, Cadence says the platform doubles verification productivity with a capacity of up to 2.3 billion gates. Cadence also reported that its mixed-signal LP flow allowed Silicon Labs to cut its MCU p... » read more

The Week In Review: Aug. 30
By Ann Mutschler - 30 Aug, 2013 - Comments: 0

By Ann Steffora Mutschler Continuing its drive towards enabling the Internet of Things (IoT), Renesas recently licensed a third Tensilica core from Cadence, this time the ConnX D2 DSP, which has acceleration packages optimized for IoT wired and wireless modem standards. Renesas previously licensed the Tensilica HiFi Audio DSP and ConnX BBE16 cores. In another deal for Cadence, Mellanox Tech... » read more

The Week In Review: May 31
By Ed Sperling - 31 May, 2013 - Comments: 0

By Ed Sperling Mentor Graphics and GlobalFoundries teamed up to deliver 20nm design kits that include Mentor’s place and route tool, including verification and conflict resolution engines for double-patterning violations. The 20nm process is used for GlobalFoundries’ 14nm finFETs. Mentor also received 16nm finFET certification from TSMC for the same tools plus its physical verification pl... » read more

The Good And Bad Of Models
By Ed Sperling - 27 Sep, 2012 - Comments: 0

By Ann Steffora Mutschler Driven by fierce competition and the fact that socket decisions are made long before silicon is manufactured, semiconductor companies today ship models and virtual prototypes to their OEMs very early in hopes of locking in the socket. Admittedly, this has been happening for some time, but due to complexity and the need for flexibility of models and virtual platf... » read more

Converge And Consolidate
By Ed Sperling - 09 Feb, 2012 - Comments: 0

Electronics has always been about convergence, and convergence inevitably spawns new companies while forcing consolidation of others. What used to be in a device moved to a board, from a board there has been a perpetual push to put things in a chip. At one point, circa 2000, analog companies claimed that mixed signal chips were a thing of the past and that there would be separate analog chip... » read more

The Wi Of CES
By Ed Sperling - 26 Jan, 2012 - Comments: 0

By Pallab Chatterjee There has already been quite a bit written about the tablets, TVs and ultrabooks that consumed most of the floor space at this year’s CES show in Las Vegas. There was an underlying technology that was brought out at the show to bind these together—wireless. As the proliferation of content consumption device continues, creating a connected network to get this media a... » read more

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