Packaging Challenges For 2018

The IC packaging market is projected to see steady growth this year, amid ongoing changes in the landscape. The outsourced semiconductor assembly and test ([getkc id="83" kc_name="OSAT"]) industry, which provides third-party packaging and test services, has been consolidating for some time. So while sales rising, the number of companies is falling. In late 2017, for example, [getentity id="2... » read more

Challenges For Future Fan-Outs

The fan-out wafer-level packaging market is heating up. At the high end, for example, several packaging houses are developing new fan-out packages that could reach a new milestone and hit or break the magic 1µm line/space barrier. But the technology presents some challenges, as it may require more expensive process flows and equipment like lithography. Fig. 1: Redistribution layers. Source: L... » read more

The Week In Review: Manufacturing

IC Insights released its preliminary top IC rankings in terms of sales for 2015. In the rankings, Intel remains in first place in terms of chip sales in 2015, followed by Samsung and TSMC. GlobalFoundries and UMC also moved up in the rankings. Beyond that, the market is in flux. “The pending mergers of Avago and Broadcom and NXP and Freescale will have a significant impact on future top-20 ra... » read more

China’s Fab Tool Biz Heats Up

For years, China has been a steady growth market for suppliers of semiconductor equipment. Internally, though, the country is comprised of trailing-edge fabs and IC-assembly houses, which means equipment vendors sell relatively mature tools and compete on price. That’s about to change, however. Today, the IC equipment business is heating up in China as the nation begins to upgrade and pour... » read more

Fab Tool M&A Slowdown?

The semiconductor industry is in the midst of a dizzying array of mergers and acquisitions. At the current pace, some 32% of all U.S. publicly traded semiconductor companies are projected to get acquired in 2015, according to FBR. But in reality, the M&A activity will slow and edge towards a 15% consolidation rate for the year, according to the firm. Still, the IC industry is bracing for... » read more

The Week In Review: Manufacturing

As semiconductor technology becomes more challenging, expect more mergers and acquisitions in the fab tool sector. In a research report issued this week, Weston Twigg, an analyst with Pacific Crest Securities, sees several possible M&A scenarios in the future. There is no evidence that any deal is pending right now. But according to Twigg, here are some possible M&As that could happen i... » read more