tag: Samsung

The Week In Review: Manufacturing And Design
By Mark LaPedus - 03 Jan, 2014 - Comments: 0

Blocking cell phone use and texting while driving have been proposed by the U.S. government and for good reason. About 10 people a day are killed in “distraction-affected” car accidents in the U.S., according to the U.S. National Highway Traffic Safety Administration. As a result, some companies are developing technologies that can block texts while driving. But according to Strategy Analyt... » read more

Tales From The Silk Road
By Jeff Chappell - 18 Dec, 2013 - Comments: 0

Recently I wrote a two-part article on the impact low-cost quad-core and octo-core mobile processors are having on the mobile handset market here in Asia. In it I briefly mentioned that many travelers and expats in this part of the world—this part being Southeast Asia, generally speaking—come here, among myriad other reasons, for the cheap electronics available. What prompted me to inves... » read more

Semiconductor New Equipment Market $32.0 Billion For 2013
By Lara Chamness - 12 Dec, 2013 - Comments: 0

Orders for new equipment slowly improved early on in 2013, with bookings reaching a peak by the second quarter before receding in the third quarter. Over this time, equipment billings, while increasing, were trending below 2012 levels. In October, book-to-bill data from both SEMI and the SEAJ show bookings are increasing once again, and this indicates a stronger fourth quarter for the semico... » read more

Non-Visual Defect Inspection: The Tech of Tomorrow?
By Jeff Chappell - 12 Dec, 2013 - Comments: 0

Remember when it first became obvious that the semiconductor manufacturing industry was going to expect lithography to resolve features smaller than the wavelength of light used in the litho tools themselves? Thanks to techniques such as the use of phase shift photomasks, sub-wavelength lithography is standard in chip fabs today. It might even be viewed as “old hat,” although still an ex... » read more

Defective R&D Funding Models
By Mark LaPedus - 12 Dec, 2013 - Comments: 0

For years, the semiconductor equipment industry has been dealing with an R&D funding gap. Here’s the basic problem: Chipmakers demand certain tools for their next-generation processes, but they are not always willing to foot a large percentage of the R&D bill. And so, the equipment vendors develop the tools and assume a large part of R&D funding--and the risks. Fair or unf... » read more

Big Changes Rock Global Smartphone Market
By Jeff Chappell - 25 Nov, 2013 - Comments: 0

BANGKOK — One of the many draws for Western travelers here in Thailand and throughout much of Asia, including China, is the availability of cheap consumer electronics. Unfortunately many of these electronic goods — little-known off-brands mimicking better-known counterparts, or white-label devices being passed off as name-brand products to unsuspecting consumers — typically are technologi... » read more

The Week In Review: Manufacturing & Design
By Mark LaPedus - 22 Nov, 2013 - Comments: 0

Intel is getting serious about the foundry business.  “Intel CEO Brian Krzanich is making some waves. This is not because Intel is becoming more market driven, but that Intel will open its foundry to ‘any’ company able to utilize the company's leading-edge technology. It’s very refreshing to see Intel make this move and could have important implications for the industry. Based on Intel... » read more

Experts At The Table: What’s Next?
By Ed Sperling - 21 Nov, 2013 - Comments: 1

Semiconductor Engineering sat down with Jim Hogan, long-time industry venture capitalist; Simon Bloch, senior director at Samsung Electronics; Sumit DasGupta, formerly Si2 senior vice president of engineering; and Mike Gianfagna, vice president of marketing at eSilicon (VP of corporate marketing at Atrenta when this roundtable was held). What follows are excerpts of that discussion. SE: What... » read more

Momentum Builds For Monolithic 3D ICs
By Mark LaPedus - 14 Nov, 2013 - Comments: 1

The 2.5D/3D chip market is heating up on several fronts. On one front, stacked-die using through-silicon vias (TSVs) is taking root. In a separate area, Samsung is sampling the world’s first 3D NAND device, with Micron and SK Hynix expected to follow suit. And now, there is another technology generating steam—monolithic 3D integrated circuits. In stacked-die, bare die are connected using... » read more

ARMing Intel
By Mark LaPedus - 14 Nov, 2013 - Comments: 0

For some time, the industry has kept a close eye on Intel’s fledging foundry business. The question is whether Intel will merely dabble in the foundry business or become a major player. The answer? It’s still too early to tell. Not long ago, Intel entered the foundry business and announced a smattering of small and niche-oriented customers, such as Achronix, Netronome and Tabula.  Micro... » read more

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