tag: Samsung

Wireless Charging Creeps Forward
By Kevin Fogarty - 28 Feb, 2018 - Comments: 1

It's well known that electricity can travel long distances through the air, but expanding beyond the boundaries of a wire has never seemed a practical or reliable way to power delicate electronics. In fact, wireless power has been widely available for years. Whether this approach will be used to extend battery life isn't entirely clear. But it is attracting renewed attention as the balance b... » read more

RISC-V Gains Its Footing
By Ann Mutschler - 26 Feb, 2018 - Comments: 3

The RISC-V instruction-set architecture, which started as a UC Berkeley project to improve energy efficiency, is gaining steam across the industry. The RISC-V Foundation's member roster gives an indication who is behind this effort. Members include Google, Nvidia, Qualcomm, Rambus, Samsung, NXP, Micron, IBM, GlobalFoundries, UltraSoC, Siemens, among many others. One of the key markets for... » read more

FD-SOI Adoption Expands
By Ed Sperling - 21 Feb, 2018 - Comments: 2

Fully depleted silicon-on-insulator (FD-SOI) is gaining ground across a number of new markets, ranging from IoT to automotive to machine learning, and diverging sharply from its original position as a less costly alternative to finFET-based designs. For years, [getkc id="220" kc_name="FD-SOI"] has been viewed as an either/or solution targeted at the same markets as bulk [gettech id="31093" c... » read more

Blog Review: Feb. 21
By Jesse Allen - 21 Feb, 2018 - Comments: 0

Mentor's Colin Walls posits that one part of the reason modern code has so many bugs may be the way we talk about them, and it's time for a change in terminology. Following up on a post about the challenges of bringing digital literacy to an area where many are unable to read, Cadence's Madhavi Rao looks at the impact agriculture-focused IoT technologies could have on rural areas in India. ... » read more

Will China Succeed In Memory?
By Mark LaPedus - 19 Feb, 2018 - Comments: 5

China's fledging memory makers are expected to reach a major milestone and move into initial production this year, although vendors are already running into various roadblocks. China's domestic vendors are focusing on two markets, 3D NAND and DRAM. In both cases local vendors are either behind in technology, struggling to develop these products, or both. And one vendor recently was hit with ... » read more

What’s On Display
By Max McDaniel - 15 Feb, 2018 - Comments: 0

Displays provide the window between consumers and the information universe. There is no place like CES, held recently in Las Vegas, to see the most exciting new and future displays. Beyond traditional technologies like television, displays also featured prominently in many of the big trends at the show: AI (Artificial Intelligence), automotive, virtual reality, IoT (Internet of Things) and conn... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 09 Feb, 2018 - Comments: 0

Chipmakers China has struck again, as the nation continues to acquire semiconductor technology. In December, Silicon Labs announced plans to acquire Sigma Designs for $282 million. The deal involves Sigma’s Z-Wave chip business. Now, Sigma Designs has sold its connectivity chip business unit to Integrated Silicon Solution Inc. (ISSI). In 2015, a Chinese consortium of investors led by Uph... » read more

Fan-Out Wars Begin
By Mark LaPedus - 05 Feb, 2018 - Comments: 3

Several packaging houses are developing the next wave of high-density fan-out packages for premium smartphones, but perhaps a bigger battle is brewing in the lower density fan-out arena. Amkor, ASE, STATS ChipPAC and others sell traditional low-density fan-out packages, although some new and competitive technologies are beginning to appear in the market. Low-density fan-out, or sometimes cal... » read more

Cheaper Packaging Options Ahead
By Ed Sperling - 05 Feb, 2018 - Comments: 0

Lower-cost packaging options and interconnects are either under development or just being commercialized, all of which could have a significant impact on the economics of advanced packaging. By far, the most cited reason why companies don't adopt advanced [getkc id="27" kc_name="packaging"] is cost. Currently, silicon [getkc id="204" kc_name="interposers"] add about $30 to the price of a med... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 02 Feb, 2018 - Comments: 0

Fab tools SEMI has announced an urgent call to action to overcome the pressing semiconductor industry challenge of recruiting new talent. In a letter to the CEOs of more than 2,000 global SEMI member companies, Ajit Manocha, SEMI’s president and CEO, called on the executives to act together to attract workers and develop the workforce vital to industry growth. In addition, it is a turbu... » read more

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