tag: Samsung

The Week In Review: Manufacturing
By Mark LaPedus - 23 Dec, 2016 - Comments: 0

Chipmakers TDK has agreed to acquire MEMS supplier InvenSense for cash at an acquisition price of $13.00 per share, for a total acquisition price of $1.3 billion. Cypress has begun volume shipments of microcontrollers (MCUs) based on its 40nm Embedded Charge-Trap (eCT) flash technology. The MCUs are made on a foundry basis at UMC. UMC’s technology is a 40nm low power (40LP) logic process.... » read more

Crazy Christmas Patents
By Brian Bailey - 22 Dec, 2016 - Comments: 0

For the past several years, I have been writing a blog that pokes fun at patent applications related to Christmas. It now appears that I am an expert in this subject matter because I received two e-mails during the course of this year. One asked how they should go about getting their Christmas ornament manufactured and marketed. The other asked if I would feature their newly released ornament i... » read more

What’s Missing In Advanced Packaging
By Ann Mutschler - 22 Dec, 2016 - Comments: 0

Even though Moore's Law is running out of steam, there is still a need to increase functional density. Increasingly, this is being done with heterogeneous integration at the package or module level. This is proving harder than it looks. At this point there are no standardized methodologies, and tools often are retrofitted versions of existing tools that don't take into account the challenges... » read more

Foundries See Mixed Future
By Mark LaPedus - 21 Dec, 2016 - Comments: 1

Amid a tumultuous business environment, the silicon foundry industry is projected to see steady growth in a number of process segments in 2017. As in past years, the foundry market is expected to grow faster than the overall IC industry in 2017. But at the same time, the IC industry—the foundry customer base—continues to witness a frenetic wave of merger and acquisition activity. Basical... » read more

Uncertainty Grows For 5nm, 3nm
By Mark LaPedus - 19 Dec, 2016 - Comments: 4

As several chipmakers ramp up their 10nm finFET processes, with 7nm just around the corner, R&D has begun for 5nm and beyond. In fact, some are already moving full speed ahead in the arena. [getentity id="22586" comment="TSMC"] recently announced plans to build a new fab in Taiwan at a cost of $15.7 billion. The proposed fab is targeted to manufacture TSMC’s 5nm and 3nm processes, whic... » read more

5 Takeaways from IEDM
By Mark LaPedus - 15 Dec, 2016 - Comments: 1

As usual, the recent IEEE International Electron Devices Meeting (IEDM) was a busy week. The event, which took place in San Francisco, featured a plethora of subjects, such as next-generation transistors and memories. The event also included tracks on non-traditional approaches like quantum and neuromorphic computing. And then, there were sessions on power semis and others. In no partic... » read more

Software Platforms Bridge The Design/Verification Gap For 5G Communications Design
By David Vye - 15 Dec, 2016 - Comments: 0

The integration of simulation technologies, system prototyping tools, and automated test equipment is critical for addressing the complexity of developing 5G wireless technology. In these cases, design teams will need to rely on a combination of simulation and prototype testing in order to ensure design robustness. Although simulation is essential to design a test bed or prototype, measurement... » read more

Fab Tool Biz Faces Challenges In 2017
By Mark LaPedus - 15 Dec, 2016 - Comments: 3

After experiencing a gradual recovery and positive growth in 2016, the semiconductor equipment industry sees a mixed picture as well as some uncertainty in 2017. In the near term, though, business is robust. Several chipmakers started to place a sizeable number of fab tool orders in the latter part of 2016, particularly in three areas—3D NAND, logic and foundry. Now, after buying the in... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 09 Dec, 2016 - Comments: 2

Chipmakers At this week’s IEEE International Electron Devices Meeting (IEDM) in San Francisco, TSMC as well as the team of GlobalFoundries, IBM and Samsung separately presented papers on 7nm finFET technology. Qualcomm has begun sampling the world’s first 10nm server processor. As the first in the Qualcomm Centriq product family, the ARM-based processor has up to 48-cores and is built ... » read more

Manufacturing Bits: Dec. 6
By Mark LaPedus - 06 Dec, 2016 - Comments: 1

The National High Magnetic Field Laboratory (MagLab) has broken an unofficial record for the world’s most powerful hybrid magnet. The 33-ton system, called the series connected hybrid (SCH) magnet, has reached its full field strength of 36 tesla. The SCH is more than 40% stronger than the previous world-record hybrid magnet. Tesla, or T, is the measurement of magnetic field strength. A ref... » read more

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