tag: Siemens EDA

Blog Review: Oct. 7
By Jesse Allen - 07 Oct, 2015 - Comments: 0

Ansys' Sunil Nakum takes a look at backing up the brain and concludes that we would need to keep following Moore's Law for a long time given the current approaches and leave several questions unanswered. There is a battle brewing between high-efficiency LED lighting and vintage-style Edison bulbs. With the latest lighting fad, Mentor's John McMillan asks, is style and nostalgia beating high-... » read more

Gaps Remain For EUV Masks
By Mark LaPedus - 02 Oct, 2015 - Comments: 4

Extreme ultraviolet (EUV) lithography is once again at a critical juncture. The oft-delayed technology is now being targeted for 7nm. But there are still a number of technologies that must come together before EUV is inserted into mass production at that node. First, the EUV source must generate more power. Second, tool uptime must improve. Third, the industry needs better EUV resists. A... » read more

Power Estimation: Early Warning System Or False Alarm?
By Brian Bailey - 02 Oct, 2015 - Comments: 0

Semiconductor Engineering sat down with a large panel of experts to discuss the state of power estimation and to find out if the current levels of accuracy are sufficient to being able to make informed decisions. Panelists included: Leah Schuth, director of technical marketing in the physical design group at [getentity id="22186" comment="ARM"]; Vic Kularni, senior vice president and general ma... » read more

Blog Review: Sept. 30
By Jesse Allen - 30 Sep, 2015 - Comments: 0

In an increasingly networked world, NXP's Lars Reger advocates for a change of perspective: one which places data protection and the security of end customers and users at the heart. Differential power analysis has been on the mind of Rambus' Aharon Etengoff recently as increasing numbers of SIM cards are being cracked, plus some counter measures that can be used. Even wondered about the ... » read more

EDA, IP Numbers Up
By Ed Sperling - 28 Sep, 2015 - Comments: 0

EDA and IP numbers increased another 8.5% in Q2, with all regions but Japan showing positive growth. Total revenue was $1.91 billion for the quarter, up from $1.76 billion in Q2 of 2014. The largest category, computer-aided engineering, was $657.2 million for the quarter, up 9.6% compared with the same period last year. IC physical design was $379.2 million, up 6% year over year, and IP was ... » read more

Is The 2.5D Supply Chain Ready?
By Ed Sperling - 28 Sep, 2015 - Comments: 0

A handful of big semiconductor companies began taking the wraps off 2.5D and fan-out packaging plans in the past couple of weeks, setting the stage for the first major shift away from Moore's Law in 50 years. Those moves coincide with reports of commercial [getkc id="82" kc_name="2.5D"] chips from chip assemblers and foundries that are now under development. There have been indications for... » read more

Is HW Or SW Running the Show?
By Brian Bailey - 24 Sep, 2015 - Comments: 1

In the past, hardware was designed and then passed over to the software team for them to add their contribution to the product. This worked when the amount of software content was small and the practice did not significantly contribute to product delays. Over time, the software content grew and today it is generally accepted that software accounts for more product expense than hardware, takes l... » read more

Can IP Integration Be Automated?
By Ann Mutschler - 24 Sep, 2015 - Comments: 1

What exactly does it mean to automate [getkc id="43" comment="IP"] integration? Ask four people in the industry and you’ll get four different answers. “The key issue is how you can assemble the hardware as quickly as you can out of pre-made pieces of IP,” said Charlie Janac, chairman and CEO of [getentity id="22674" e_name="Arteris"]. To Simon Rance, senior product manager in the ... » read more

ROI Not There Yet For SysML
By Ann Mutschler - 24 Sep, 2015 - Comments: 3

At some point down the road in the realm of system-level design, the Systems Modeling Language (SysML) dialect of the Unified Modeling Language (UML) standard may drive into semiconductor design. So far, however, a return on investment has not been established for its use. SysML is defined as a general-purpose visual modeling language for systems engineering applications, and it supports the... » read more

Wearable Devices: A Limitless Future
By Warren Kurisu - 24 Sep, 2015 - Comments: 0

Today, there are many wearable systems across industries including medical and health care, safety, smartwatches, smart goggles and glasses, smart shoes and clothing — even smart pet trackers! So why is there such a proliferation of devices, even though many of these portable/embedded devices have been around for decades? There are a few key technical trends enabling these devices. F... » read more

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